+ | EML |
ALD-EML
| Deposition | CVD
| Atomic Layer Deposition
| EML
|
+ | EML |
BalzerSputterer
| Deposition | Sputter
| Thin sputter coating of samples
| EML
|
+ | EML |
plasmatherm
| Deposition, Etch | PECVD, RIE
| Plasma Etch and Deposition
| EML
|
+ | EML |
SputtererAJA
| Deposition | Sputter
| Sputter deposition tool
| EML
|
+ | TRL |
2Dtransfer-platingHood
| Wet | Acids
| Electroplating wet bench and fume hood
| Red
|
+ | ICL |
5A-GateOx
| Diffusion | Oxidation
| Diffusion tube for gate oxide growth
| Green
|
+ | ICL |
5B-Anneal
| Diffusion | Bake
| Annealing tube
| Green
|
+ | ICL |
5C-FieldOx
| Diffusion | Oxidation
| Diffusion tube for wet oxide growth of thicker films
| Green
|
+ | ICL |
5D-ThickOx
| Diffusion | Oxidation
| Diffusion tube for wet oxide growth of thicker films
| Green
|
+ | ICL |
6A-nPoly
| Diffusion | CVD
| Polysilicon deposition tube for n-type poly Si
| Green
|
+ | ICL |
6B-Poly
| Diffusion | CVD
| Polysilicon deposition tube for p-type poly Si
| Green
|
+ | ICL |
6C-LTO
| Diffusion | CVD
| Low temperature CVD oxide deposition
| Green
|
+ | ICL |
6D-Nitride
| Diffusion | CVD
| Deposition of stoichiometric silicon nitride
| Green
|
+ | ICL |
ALD
| Deposition | CVD
| Atomic Layer Deposition
| Red
|
+ | ICL |
ALD-Oxford
| Deposition | CVD, PECVD
| Atomic Layer Deposition
| Green
|
+ | ICL |
pTrack
| Photo | Coat
| Automated coater and developer track
| Green
|
+ | ICL |
concept1
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, and TEOS
| Green
|
+ | ICL |
DCVD
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, and a-Si
| Green
|
+ | ICL |
endura
| Deposition | Sputter
| Metal sputter deposition
| Green
|
+ | ICL |
epi-Centura
| Deposition | CVD
| Not open to public
| Green
|
+ | ICL |
Oxford-100_PECVD
| Deposition, Etch | PECVD
| Dual chamber PECVD and plasma etch tool
| Red
|
+ | ICL |
Oxford-100_Etch
| Deposition, Etch | RIE
| Dual chamber PECVD and plasma etch tool
| Red
|
+ | ICL |
VTR
| Diffusion | CVD
| Low stress silicon nitride deposition
| Green
|
+ | TRL |
A1-GateOx
| Diffusion | Oxidation
| Thermal Oxidation for Green Silicon Wafers
| Green
|
+ | TRL |
A2-WetOxBond
| Diffusion | Oxidation
| Thermal Oxidation and other thermal process for GREEN Si wafers
| Green
|
+ | TRL |
A3-Sinter
| Diffusion | Bake
| Sintering for GREEN Si wafers
| Green
|
+ | TRL |
A4-III-Vanneal
| Diffusion | Bake
| Annealing for GREEN III-V samples
| Red
|
+ | TRL |
AJA-TRL
| Deposition | Sputter
| Sputter deposition tool
| Red
|
+ | TRL |
B1-Au
| Diffusion | Oxidation
| Gold compatible anneal tube
| Red
|
+ | TRL |
B2-Ox-alloy-Poly
| Diffusion | Oxidation
| Thermal Oxidation and LPCVD Polysilicon for RED wafers
| Green
|
+ | TRL |
B3-DryOx
| Diffusion | Oxidation
| Thermal Oxidation
| Green
|
+ | TRL |
B4-Poly
| Diffusion | CVD
| LPCVD polysilicon for Green wafers
| Green
|
+ | TRL |
Balzer-Elionix
| Deposition | Sputter
| SEM or EBL sample preparation
| Red
|
+ | TRL |
coater
| Photo | Coat
| Manual spin-coater for photoresists
| Red &Green
|
+ | TRL |
HMDS-TRL
| Photo | Bake
| HMDS oven
| Red &Green
|
+ | TRL |
parylene
| Deposition | CVD
| Parylene depopsition
| Red
|
+ | TRL |
PMMAspinner
| Photo | Coat
| Manual coater for PMMA and other photoresists
| Red &Green
|
+ | TRL |
PZTcoater
| Deposition | Spin-Coat
| Coater to apply PZT films
| Red
|
+ | TRL |
sts-CVD
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, a-Si, SiC, and P-doped a-Si
| Red
|
+ | TRL |
SU8spinner
| Photo | Coat
| Manual spin-coater for SU8 resists
| Purple
|