In most tools, only the top side of the wafer is impacted by the process.
Process | Lab | Tool | Process Category | Subcategory | Description
| Color Code
|
---|
+ | EBL |
Elionix
| Photo | Expose
| Electron beam lithography system
| Red &Green
|
+ | EML |
ALD-EML
| Deposition | CVD
| Atomic Layer Deposition
| EML
|
+ | EML |
anneal-furnace
| Diffusion | Bake
| Anneal Furnace
| EML
|
+ | EML |
BalzerSputterer
| Deposition | Sputter
| Thin sputter coating of samples
| EML
|
+ | EML |
Box-Furnace
| Diffusion | Bake
| Anneal Furnace
| EML
|
+ | EML |
coater-EML
| Photo | Coat
| Photoresist Coater
| EML
|
+ | EML |
dektak-EML
| Metrology | Profile
| Surface Profilerometer
| EML
|
+ | EML |
eBeam-AJA
| Deposition | Evaporate
| Metal and dielectric evaporator
| EML
|
+ | EML |
filmetrics
| Metrology | Thickness
| Thin Film Optical Measurement
| EML
|
+ | EML |
MA-4
| Photo | Expose
| Contact Lithography Mask Aligner
| EML
|
+ | EML |
OxidationTube
| Diffusion | Oxidation
| Oxidation Furnace
| EML
|
+ | EML |
plasmatherm
| Deposition, Etch | PECVD, RIE
| Plasma Etch and Deposition
| EML
|
+ | EML |
RTA-EML
| Diffusion | Bake
| Rapid Thermal Annealing
| EML
|
+ | EML |
semNeo
| Metrology | SEM
| Very Basic Electron Microscope
| EML
|
+ | EML |
SputtererAJA
| Deposition | Sputter
| Sputter deposition tool
| EML
|
+ | ICL |
4-pt-probe
| Metrology | Electrical
| Sheet resistance measurement of semiconductors
| Red
|
+ | ICL |
AFM
| Metrology | Profile
| Atomic Force Microscope for Surface Analysis
| Red &Green
|
+ | ICL |
ALD
| Deposition | CVD
| Atomic Layer Deposition
| Red
|
+ | ICL |
ALD-Oxford
| Deposition | CVD, PECVD
| Atomic Layer Deposition
| Green
|
+ | ICL |
AME5000
| Etch | RIE
| RIE etcher for frontend silicon processes
| Green
|
+ | ICL |
asher-ICL
| Photo | Clean
| Single wafer oxygen plasma for photoresist removal
| Green
|
+ | ICL |
pTrack
| Photo | Coat
| Automated coater and developer track
| Green
|
+ | ICL |
concept1
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, and TEOS
| Green
|
+ | ICL |
cv
| Metrology | Electrical
| Electrical characterization of dielectrics
| Green
|
+ | ICL |
DCVD
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, and a-Si
| Green
|
+ | ICL |
diesaw
| Packaging | Physical
| Wafer dicing saw
| Red
|
+ | ICL |
diesaw-3240
| Packaging | Physical
| Wafer dicing saw
| Red
|
+ | ICL |
eBeam-EVO
| Deposition | Evaporate
| Metal evaporator of CMOS compatible metals
| Green
|
+ | ICL |
endura
| Deposition | Sputter
| Metal sputter deposition
| Green
|
+ | ICL |
epi-Centura
| Deposition | CVD
| Not open to public
| Green
|
+ | ICL |
GnP
| Wet | Other
| Chemical Mechanical Polishing to planarize surfaces
| Red &Green
|
+ | ICL |
goldwire
| Packaging | Physical
| Gold ball bonder for device packaging
| Red
|
+ | ICL |
i-stepper
| Photo | Expose
| i-line stepper
| Red &Green
|
+ | ICL |
LAM490B
| Etch | RIE
| Chlorine based plasma etching of silicon
| Green
|
+ | ICL |
LAM590-ICL
| Etch | RIE
| Fluorine based plasma etching of silicon oxide and nitrides
| Green
|
+ | ICL |
Oxford-100_PECVD
| Deposition, Etch | PECVD
| Dual chamber PECVD and plasma etch tool
| Red
|
+ | ICL |
Oxford-100_Etch
| Deposition, Etch | RIE
| Dual chamber PECVD and plasma etch tool
| Red
|
+ | ICL |
P10
| Metrology | Profile
| Stylus profilerometer
| Green
|
+ | ICL |
rainbow
| Etch | RIE
| Chlorine based plasma etcher for metals
| Green
|
+ | ICL |
RTA2
| Diffusion | Bake
| Rapid Thermal Annealing
| Green
|
+ | ICL |
RTA-pieces
| Diffusion | Bake
| Rapid Thermal Annealing
| Red
|
+ | ICL |
RTP
| Diffusion | Bake
| Rapid Thermal Annealing
| Green
|
+ | ICL |
RTP-Si
| Diffusion | Bake
| Rapid Thermal Annealing
| Green
|
+ | ICL |
semZeiss
| Metrology | SEM
| Scanning Electron Microscope
| Red &Green
|
+ | ICL |
SM-300
| Metrology | Thickness
| Thickness measurement for CMP processing
| Red &Green
|
+ | ICL |
UV1280
| Metrology | Thickness
| Thin film characterization
| Green
|
+ | ICL |
wykoICL
| Metrology | Profile
| Optical profiling system
| Green
|
+ | TRL |
AJA-TRL
| Deposition | Sputter
| Sputter deposition tool
| Red
|
+ | TRL |
asherMatrix-TRL
| Photo | Clean
| Single wafer oxygen plasma for photoresist removal
| Red
|
+ | TRL |
Balzer-Elionix
| Deposition | Sputter
| SEM or EBL sample preparation
| Red
|
+ | TRL |
CCNT
| Deposition | PECVD
| Carbon nanotube growth
| Red
|
+ | TRL |
coater
| Photo | Coat
| Manual spin-coater for photoresists
| Red &Green
|
+ | TRL |
dek-NoAu
| Metrology | Profile
| Stylus Profilerometer
| Green
|
+ | TRL |
dektak-XT
| Metrology | Profile
| Stylus Profilerometer
| Red
|
+ | TRL |
develop-Brewer
| Photo | Coat
| Resist develop and postbake
| Red &Green
|
+ | TRL |
eBeamAu
| Deposition | Evaporate
| Metal evaporator
| Red
|
+ | TRL |
eBeamFP
| Deposition | Evaporate
| Fast pumping metal evaporator
| Red
|
+ | TRL |
ellipsometer-TRL
| Metrology | Thickness
| Thin film thickness measurement
| Red &Green
|
+ | TRL |
EV1
| Photo | Expose
| Contact mask aligner
| Red &Green
|
+ | TRL |
EV501
| Photo | Bond
| Bonder system to apply heat, vacuum and pressure
| Red &Green
|
+ | TRL |
EV620
| Photo | Bond
| Aligner for bonding
| Red &Green
|
+ | TRL |
EV-LC
| Photo | Expose
| Contact mask aligner
| Red &Green
|
+ | TRL |
Filmetrics-TRL
| Metrology | Thickness
| Thin film thickness measurement
| Red &Green
|
+ | TRL |
Hall-probe
| Metrology | Electrical
| Carrier measurement
| Red
|
+ | TRL |
Heidelberg
| Photo | Expose
| Laser direct-write exposure for wafers and masks
| Red &Green
|
+ | TRL |
hotplate1
| Photo | Bake
| Hotplate for lithography
| Red &Green
|
+ | TRL |
hotplate2
| Photo | Bake
| Hotplate for lithography
| Red &Green
|
+ | TRL |
hotplate300
| Photo | Bake
| Hotplate for lithography
| Red &Green
|
+ | TRL |
IV-probe
| Metrology | Electrical
| Probe station with curve tracer for IV measurement
| Red
|
+ | TRL |
LAM590-TRL
| Etch | RIE
| Fluorine based plasma etching of oxide and nitrides
| Red
|
+ | TRL |
MA-6
| Photo | Expose
| Contact mask aligner
| Red &Green
|
+ | TRL |
MLA-150
| Photo | Expose
| Direct-write lithography for wafers and larger pieces
| Red &Green
|
+ | TRL |
nanospec
| Metrology | Thickness
| Thin film thickness measurement
| Red &Green
|
+ | TRL |
OAI-Flood
| Photo | Expose
| Flood exposure for image reversal resists
| Red &Green
|
+ | TRL |
parylene
| Deposition | CVD
| Parylene depopsition
| Red
|
+ | TRL |
plasmaquest
| Etch | RIE
| Fluorine and Chlorine general purpose plasma deposition and etch tool
| Red
|
+ | TRL |
PMMAspinner
| Photo | Coat
| Manual coater for PMMA and other photoresists
| Red &Green
|
+ | TRL |
PZTcoater
| Deposition | Spin-Coat
| Coater to apply PZT films
| Red
|
+ | TRL |
Resonetics
| Photo | Expose
| Laser ablation system
| Red
|
+ | TRL |
RTA-HiT
| Diffusion | Bake
| Rapid Thermal Annealing
| Red
|
+ | TRL |
SAMCO
| Etch | RIE
| Chlorine based plasma etcher for III-V materials
| Red
|
+ | TRL |
sts1
| Etch | DRIE
| Deep reactive ion etcher for silicon
| Red
|
+ | TRL |
sts2
| Etch | DRIE
| Deep reactive ion etcher for silicon
| Green
|
+ | TRL |
sts-CVD
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, a-Si, SiC, and P-doped a-Si
| Red
|
+ | TRL |
sts-Pegasus
| Etch | DRIE
| Deep reactive ion etcher for silicon
| Red
|
+ | TRL |
SU8spinner
| Photo | Coat
| Manual spin-coater for SU8 resists
| Purple
|
+ | TRL |
TBM-8
| Photo | Bond
| Front-to-back alignement measurement
| Red &Green
|
+ | TRL |
UVozone-Au
| Etch | Clean
| Cleans residual organics
| Red
|
+ | TRL |
WYKO
| Metrology | Profile
| Optical profiling system
| Red &Green
|
+ | TRL |
XeF2
| Etch | RIE
| XeF2 isotropic etching of silicon
| Red
|