The process uses a plasma
Process | Lab | Tool | Process Category | Subcategory | Description
| Color Code
|
---|
+ | EML |
asher-EML
| Photo | Clean
| Oxygen Plasma
| EML
|
+ | EML |
BalzerSputterer
| Deposition | Sputter
| Thin sputter coating of samples
| EML
|
+ | EML |
plasmatherm
| Deposition, Etch | PECVD, RIE
| Plasma Etch and Deposition
| EML
|
+ | EML |
SputtererAJA
| Deposition | Sputter
| Sputter deposition tool
| EML
|
+ | ICL |
ALD-Oxford
| Deposition | CVD, PECVD
| Atomic Layer Deposition
| Green
|
+ | ICL |
AME5000
| Etch | RIE
| RIE etcher for frontend silicon processes
| Green
|
+ | ICL |
asher-ICL
| Photo | Clean
| Single wafer oxygen plasma for photoresist removal
| Green
|
+ | ICL |
concept1
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, and TEOS
| Green
|
+ | ICL |
DCVD
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, and a-Si
| Green
|
+ | ICL |
endura
| Deposition | Sputter
| Metal sputter deposition
| Green
|
+ | ICL |
epi-Centura
| Deposition | CVD
| Not open to public
| Green
|
+ | ICL |
LAM490B
| Etch | RIE
| Chlorine based plasma etching of silicon
| Green
|
+ | ICL |
LAM590-ICL
| Etch | RIE
| Fluorine based plasma etching of silicon oxide and nitrides
| Green
|
+ | ICL |
Oxford-100_PECVD
| Deposition, Etch | PECVD
| Dual chamber PECVD and plasma etch tool
| Red
|
+ | ICL |
Oxford-100_Etch
| Deposition, Etch | RIE
| Dual chamber PECVD and plasma etch tool
| Red
|
+ | ICL |
rainbow
| Etch | RIE
| Chlorine based plasma etcher for metals
| Green
|
+ | ICL |
VTR
| Diffusion | CVD
| Low stress silicon nitride deposition
| Green
|
+ | TRL |
AJA-TRL
| Deposition | Sputter
| Sputter deposition tool
| Red
|
+ | TRL |
asherMatrix-TRL
| Photo | Clean
| Single wafer oxygen plasma for photoresist removal
| Red
|
+ | TRL |
asher-TRL
| Photo | Clean
| Barrel asher for resist removal
| Red &Green
|
+ | TRL |
Balzer-Elionix
| Deposition | Sputter
| SEM or EBL sample preparation
| Red
|
+ | TRL |
CCNT
| Deposition | PECVD
| Carbon nanotube growth
| Red
|
+ | TRL |
LAM590-TRL
| Etch | RIE
| Fluorine based plasma etching of oxide and nitrides
| Red
|
+ | TRL |
plasmaquest
| Etch | RIE
| Fluorine and Chlorine general purpose plasma deposition and etch tool
| Red
|
+ | TRL |
SAMCO
| Etch | RIE
| Chlorine based plasma etcher for III-V materials
| Red
|
+ | TRL |
sts1
| Etch | DRIE
| Deep reactive ion etcher for silicon
| Red
|
+ | TRL |
sts2
| Etch | DRIE
| Deep reactive ion etcher for silicon
| Green
|
+ | TRL |
sts-CVD
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, a-Si, SiC, and P-doped a-Si
| Red
|
+ | TRL |
sts-Pegasus
| Etch | DRIE
| Deep reactive ion etcher for silicon
| Red
|
+ | TRL |
XeF2
| Etch | RIE
| XeF2 isotropic etching of silicon
| Red
|
+ | LEAP |
PlasmaCleaner
| Packaging | Clean
| Plasma parts cleaning
| Red
|