Machines by Material Keyword: Non-CMOS Metals
| Process | Lab | Tool | Process Category | Subcategory | Description | |
|---|---|---|---|---|---|---|
| EML | acid-hood-EML | Wet | Solvents | General Purpose Acid Fume-Hood | ||
| EML | anneal-furnace | Diffusion | Bake | Anneal Furnace | ||
| EML | BalzerSputterer | Deposition | Sputter | Thin sputter coating of samples | ||
| EML | Box-Furnace | Diffusion | Bake | Anneal Furnace | ||
| EML | eBeam-AJA | Deposition | Evaporate | Metal and dielectric evaporator | ||
| EML | parametric-tester | Metrology | Electrical | Probe station for electrical measurements | ||
| EML | plasmatherm | Deposition, Etch | PECVD, RIE | Plasma Etch and Deposition | ||
| EML | RTA-EML | Diffusion | Bake | Rapid Thermal Annealing | ||
| EML | SputtererAJA | Deposition | Sputter | Sputter deposition tool | ||
| TRL | 2Dtransfer-platingHood | Wet | Acids | Electroplating wet bench and fume hood | ||
| ICL | 4-pt-probe | Metrology | Electrical | Sheet resistance measurement of semiconductors | ||
| ICL | cv | Metrology | Electrical | Electrical characterization of dielectrics | ||
| ICL | GnP | Wet | Other | Chemical Mechanical Polishing to planarize surfaces | ||
| ICL | goldwire | Packaging | Physical | Gold ball bonder for device packaging | ||
| ICL | Oxford-100_PECVD | Deposition, Etch | PECVD | Dual chamber PECVD and plasma etch tool | ||
| ICL | Oxford-100_Etch | Deposition, Etch | RIE | Dual chamber PECVD and plasma etch tool | ||
| MTL | Procedures-Deposition | Procedures | Deposit | Deposition of thin films | ||
| MTL | Procedures-Etching | Procedures | Etch | Etching of materials | ||
| MTL | Procedures-Metrology | Procedures | Metrology | Test and Measurement | ||
| TRL | A3-Sinter | Diffusion | Bake | Sintering for GREEN Si wafers | ||
| TRL | acid-hood | Wet | Acids | Acid processing station | ||
| TRL | AJA-TRL | Deposition | Sputter | Sputter deposition tool | ||
| TRL | Balzer-Elionix | Deposition | Sputter | SEM or EBL sample preparation | ||
| TRL | eBeamAu | Deposition | Evaporate | Metal evaporator | ||
| TRL | eBeamFP | Deposition | Evaporate | Fast pumping metal evaporator | ||
| TRL | Greenflo | Wet | Acids | Acid processing station | ||
| TRL | Hall-probe | Metrology | Electrical | Carrier measurement | ||
| TRL | IV-probe | Metrology | Electrical | Probe station with curve tracer for IV measurement | ||
| TRL | plasmaquest | Etch | RIE | Fluorine and Chlorine general purpose plasma deposition and etch tool | ||
| TRL | Resonetics | Photo | Expose | Laser ablation system | ||
| TRL | RTA-HiT | Diffusion | Bake | Rapid Thermal Annealing | ||
| TRL | SAMCO | Etch | RIE | Chlorine based plasma etcher for III-V materials | ||
| LEAP | AutoBonder | Packaging | Physical | Automated wirebonder | ||
| LEAP | BallBonder | Packaging | Physical | Manual ball bonder | ||
| LEAP | WedgeBonder | Packaging | Physical | Manual wedge bonder |