Equipment
| Lab and Coral Name | EML / acid-hood-EML |
| Model | 0 |
| Specialist | Kurt Broderick (Timothy Turner, Gary Riggott) |
| Physical Location | TBD |
Classification
| Process Category | Wet |
| Subcategory | Solvents |
| Material Keywords | Silicon, III-V, GaN, Quartz, Pyrex, SiO2, SiNx, Dielectrics, CMOS Metals, Non-CMOS Metals, Non-Standard Materials, 2D Materials, Polyimide, SU8, Other Polymers, Photoresist, EBL Resist, Acids |
| Sample Size | 6" Wafers, 4" Wafers, 7" Photo Plates, 5" Photo Plates, Pieces |
| Alternative | TRL / acid-hood |
| Keywords | single wafer, manual load, multiple pieces, both sides of sample, isotropic etch, temperature, manual operation |
Description
The acid hood in EML allows for sample cleaning and film etching using a wide variety of available chemicals. Hot plates are also available for chemical processing at elevated temperatures. Quartz, Teflon, and other plastics chemical containers are available for use with compatible chemicals. Sample holders include 6" and 4" Teflon wafer boats in addition to small sample holders. N2 gun available for sample drying.
| Best for | Experimental materials |
| Limitations | No dump-rinser, chemical aspirator, or SRD available. Need to manually dilute acids and rinse for a long time (for what seems like an eternity) when disposing. |
| Characteristics/FOM | |
| Caution with | Be careful with rinsing and disposal, to avoid accidental splashes or spills. Check PPE before and after use for splashes, discard and replace sleeves or gloves if not safe. |
| Machine Charges | 8/run |
Documents
SOP
| Wet Processing | Rules and guidelines for wet processing |
Documents
| Etch rates part 2 | Berkeley etch rate paper |
Process Matrix Details
PTC Matrix does not apply for EML
Ever been in EMLSamples from EML are never permitted to return to ICL or TRL