Silicon nitride.
Process | Lab | Tool | Process Category | Subcategory | Description
| Color Code
|
---|
+ | EML |
acid-hood-EML
| Wet | Solvents
| General Purpose Acid Fume-Hood
| EML
|
+ | EML |
anneal-furnace
| Diffusion | Bake
| Anneal Furnace
| EML
|
+ | EML |
Box-Furnace
| Diffusion | Bake
| Anneal Furnace
| EML
|
+ | EML |
filmetrics
| Metrology | Thickness
| Thin Film Optical Measurement
| EML
|
+ | EML |
plasmatherm
| Deposition, Etch | PECVD, RIE
| Plasma Etch and Deposition
| EML
|
+ | EML |
RTA-EML
| Diffusion | Bake
| Rapid Thermal Annealing
| EML
|
+ | ICL |
5B-Anneal
| Diffusion | Bake
| Annealing tube
| Green
|
+ | ICL |
6D-Nitride
| Diffusion | CVD
| Deposition of stoichiometric silicon nitride
| Green
|
+ | ICL |
AME5000
| Etch | RIE
| RIE etcher for frontend silicon processes
| Green
|
+ | ICL |
concept1
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, and TEOS
| Green
|
+ | ICL |
DCVD
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, and a-Si
| Green
|
+ | ICL |
GnP
| Wet | Other
| Chemical Mechanical Polishing to planarize surfaces
| Red &Green
|
+ | ICL |
LAM490B
| Etch | RIE
| Chlorine based plasma etching of silicon
| Green
|
+ | ICL |
LAM590-ICL
| Etch | RIE
| Fluorine based plasma etching of silicon oxide and nitrides
| Green
|
+ | ICL |
nitrEtch-HotPhos
| Wet | Acids
| Hot phosphoric nitride etch bath
| Green
|
+ | ICL |
Oxford-100_PECVD
| Deposition, Etch | PECVD
| Dual chamber PECVD and plasma etch tool
| Red
|
+ | ICL |
Oxford-100_Etch
| Deposition, Etch | RIE
| Dual chamber PECVD and plasma etch tool
| Red
|
+ | ICL |
UV1280
| Metrology | Thickness
| Thin film characterization
| Green
|
+ | ICL |
VTR
| Diffusion | CVD
| Low stress silicon nitride deposition
| Green
|
| MTL |
Procedures-Deposition
| Procedures | Deposit
| Deposition of thin films
| Red &Green
|
| MTL |
Procedures-Etching
| Procedures | Etch
| Etching of materials
| Red &Green
|
| MTL |
Procedures-Metrology
| Procedures | Metrology
| Test and Measurement
| Red &Green
|
+ | TRL |
A3-Sinter
| Diffusion | Bake
| Sintering for GREEN Si wafers
| Green
|
+ | TRL |
acid-hood
| Wet | Acids
| Acid processing station
| Red &Green
|
+ | TRL |
ellipsometer-TRL
| Metrology | Thickness
| Thin film thickness measurement
| Red &Green
|
+ | TRL |
Filmetrics-TRL
| Metrology | Thickness
| Thin film thickness measurement
| Red &Green
|
+ | TRL |
Greenflo
| Wet | Acids
| Acid processing station
| Red &Green
|
+ | TRL |
HMDS-TRL
| Photo | Bake
| HMDS oven
| Red &Green
|
+ | TRL |
LAM590-TRL
| Etch | RIE
| Fluorine based plasma etching of oxide and nitrides
| Red
|
+ | TRL |
nanospec
| Metrology | Thickness
| Thin film thickness measurement
| Red &Green
|
+ | TRL |
plasmaquest
| Etch | RIE
| Fluorine and Chlorine general purpose plasma deposition and etch tool
| Red
|
+ | TRL |
sts1
| Etch | DRIE
| Deep reactive ion etcher for silicon
| Red
|
+ | TRL |
sts2
| Etch | DRIE
| Deep reactive ion etcher for silicon
| Green
|
+ | TRL |
sts-CVD
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, a-Si, SiC, and P-doped a-Si
| Red
|
+ | TRL |
sts-Pegasus
| Etch | DRIE
| Deep reactive ion etcher for silicon
| Red
|