The tool has the ability to heat up (or possibly cool down) the wafer, often through a heated chuck or other temperature controlled environment.
Process | Lab | Tool | Process Category | Subcategory | Description
| Color Code
|
---|
+ | EML |
acid-hood-EML
| Wet | Solvents
| General Purpose Acid Fume-Hood
| EML
|
+ | EML |
ALD-EML
| Deposition | CVD
| Atomic Layer Deposition
| EML
|
+ | EML |
anneal-furnace
| Diffusion | Bake
| Anneal Furnace
| EML
|
+ | EML |
Box-Furnace
| Diffusion | Bake
| Anneal Furnace
| EML
|
+ | EML |
hotpress
| Photo | Bond
| Pressing for thermoplastic films
| EML
|
+ | EML |
OxidationTube
| Diffusion | Oxidation
| Oxidation Furnace
| EML
|
+ | EML |
plasmatherm
| Deposition, Etch | PECVD, RIE
| Plasma Etch and Deposition
| EML
|
+ | EML |
RTA-EML
| Diffusion | Bake
| Rapid Thermal Annealing
| EML
|
+ | EML |
vac-oven
| Diffusion | Bake
| Temperature controlled vacuum oven
| EML
|
+ | TRL |
2Dtransfer-platingHood
| Wet | Acids
| Electroplating wet bench and fume hood
| Red
|
+ | ICL |
5A-GateOx
| Diffusion | Oxidation
| Diffusion tube for gate oxide growth
| Green
|
+ | ICL |
5B-Anneal
| Diffusion | Bake
| Annealing tube
| Green
|
+ | ICL |
5C-FieldOx
| Diffusion | Oxidation
| Diffusion tube for wet oxide growth of thicker films
| Green
|
+ | ICL |
5D-ThickOx
| Diffusion | Oxidation
| Diffusion tube for wet oxide growth of thicker films
| Green
|
+ | ICL |
6A-nPoly
| Diffusion | CVD
| Polysilicon deposition tube for n-type poly Si
| Green
|
+ | ICL |
6B-Poly
| Diffusion | CVD
| Polysilicon deposition tube for p-type poly Si
| Green
|
+ | ICL |
6C-LTO
| Diffusion | CVD
| Low temperature CVD oxide deposition
| Green
|
+ | ICL |
6D-Nitride
| Diffusion | CVD
| Deposition of stoichiometric silicon nitride
| Green
|
+ | ICL |
ALD
| Deposition | CVD
| Atomic Layer Deposition
| Red
|
+ | ICL |
ALD-Oxford
| Deposition | CVD, PECVD
| Atomic Layer Deposition
| Green
|
+ | ICL |
asher-ICL
| Photo | Clean
| Single wafer oxygen plasma for photoresist removal
| Green
|
+ | ICL |
pTrack
| Photo | Coat
| Automated coater and developer track
| Green
|
+ | ICL |
concept1
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, and TEOS
| Green
|
+ | ICL |
DCVD
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, and a-Si
| Green
|
+ | ICL |
epi-Centura
| Deposition | CVD
| Not open to public
| Green
|
+ | ICL |
goldwire
| Packaging | Physical
| Gold ball bonder for device packaging
| Red
|
+ | ICL |
nitrEtch-HotPhos
| Wet | Acids
| Hot phosphoric nitride etch bath
| Green
|
+ | ICL |
Oxford-100_PECVD
| Deposition, Etch | PECVD
| Dual chamber PECVD and plasma etch tool
| Red
|
+ | ICL |
Oxford-100_Etch
| Deposition, Etch | RIE
| Dual chamber PECVD and plasma etch tool
| Red
|
+ | ICL |
premetal-Piranha
| Wet | Acids
| Piranha resist removal and cleaning station
| Green
|
+ | ICL |
rca-ICL
| Diffusion | Clean
| Wafer cleaning before diffusion tubes
| Green
|
+ | ICL |
RTA2
| Diffusion | Bake
| Rapid Thermal Annealing
| Green
|
+ | ICL |
RTA-pieces
| Diffusion | Bake
| Rapid Thermal Annealing
| Red
|
+ | ICL |
RTP
| Diffusion | Bake
| Rapid Thermal Annealing
| Green
|
+ | ICL |
RTP-Si
| Diffusion | Bake
| Rapid Thermal Annealing
| Green
|
+ | ICL |
TMAH-KOHhood
| Wet | Acids
| Silicon bulk wet etching
| Red &Green
|
+ | ICL |
VTR
| Diffusion | CVD
| Low stress silicon nitride deposition
| Green
|
+ | TRL |
A1-GateOx
| Diffusion | Oxidation
| Thermal Oxidation for Green Silicon Wafers
| Green
|
+ | TRL |
A2-WetOxBond
| Diffusion | Oxidation
| Thermal Oxidation and other thermal process for GREEN Si wafers
| Green
|
+ | TRL |
A3-Sinter
| Diffusion | Bake
| Sintering for GREEN Si wafers
| Green
|
+ | TRL |
A4-III-Vanneal
| Diffusion | Bake
| Annealing for GREEN III-V samples
| Red
|
+ | TRL |
acid-hood
| Wet | Acids
| Acid processing station
| Red &Green
|
+ | TRL |
B1-Au
| Diffusion | Oxidation
| Gold compatible anneal tube
| Red
|
+ | TRL |
B2-Ox-alloy-Poly
| Diffusion | Oxidation
| Thermal Oxidation and LPCVD Polysilicon for RED wafers
| Green
|
+ | TRL |
B3-DryOx
| Diffusion | Oxidation
| Thermal Oxidation
| Green
|
+ | TRL |
B4-Poly
| Diffusion | CVD
| LPCVD polysilicon for Green wafers
| Green
|
+ | TRL |
CCNT
| Deposition | PECVD
| Carbon nanotube growth
| Red
|
+ | TRL |
EV501
| Photo | Bond
| Bonder system to apply heat, vacuum and pressure
| Red &Green
|
+ | TRL |
FLX
| Metrology | Profile
| Thin film stress measurement
| Red &Green
|
+ | TRL |
Greenflo
| Wet | Acids
| Acid processing station
| Red &Green
|
+ | TRL |
HMDS-TRL
| Photo | Bake
| HMDS oven
| Red &Green
|
+ | TRL |
hotplate1
| Photo | Bake
| Hotplate for lithography
| Red &Green
|
+ | TRL |
hotplate2
| Photo | Bake
| Hotplate for lithography
| Red &Green
|
+ | TRL |
hotplate300
| Photo | Bake
| Hotplate for lithography
| Red &Green
|
+ | TRL |
parylene
| Deposition | CVD
| Parylene depopsition
| Red
|
+ | TRL |
postbake
| Photo | Bake
| Bake oven 120C
| Red &Green
|
+ | TRL |
prebakeovn
| Photo | Bake
| Bake oven 90C
| Red &Green
|
+ | TRL |
PZTfurnace
| Deposition | Bake
| Bake oven for PZT coated wafers
| Red
|
+ | TRL |
rca-TRL
| Diffusion | Clean
| Wafer cleaning before diffusion tubes
| Green
|
+ | TRL |
RTA-HiT
| Diffusion | Bake
| Rapid Thermal Annealing
| Red
|
+ | TRL |
SAMCO
| Etch | RIE
| Chlorine based plasma etcher for III-V materials
| Red
|
+ | TRL |
SolventHood-TRL
| Wet | Solvents
| Solvent fume hood
| Red &Green
|
+ | TRL |
sts-CVD
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, a-Si, SiC, and P-doped a-Si
| Red
|
+ | TRL |
sts-Pegasus
| Etch | DRIE
| Deep reactive ion etcher for silicon
| Red
|
+ | TRL |
SU8oven
| Photo | Bake
| Oven to dry foil from SU8 coater
| Purple
|
+ | TRL |
varTemp
| Photo | Bake
| Bake oven for variable temperature
| Red
|
+ | LEAP |
AutoBonder
| Packaging | Physical
| Automated wirebonder
| Red
|
+ | LEAP |
BallBonder
| Packaging | Physical
| Manual ball bonder
| Red
|
+ | LEAP |
WedgeBonder
| Packaging | Physical
| Manual wedge bonder
| Red
|
+ | LEAP |
PlasmaCleaner
| Packaging | Clean
| Plasma parts cleaning
| Red
|
+ | LEAP |
ReflowOven
| Packaging | Bake
| Reflow oven
| Red
|