Machines by Material Keyword: Photoresist
Process | Lab | Tool | Process Category | Subcategory | Description | |
---|---|---|---|---|---|---|
EML | acid-hood-EML | Wet | Solvents | General Purpose Acid Fume-Hood | ||
EML | asher-EML | Photo | Clean | Oxygen Plasma | ||
EML | coater-EML | Photo | Coat | Photoresist Coater | ||
EML | eBeam-AJA | Deposition | Evaporate | Metal and dielectric evaporator | ||
EML | filmetrics | Metrology | Thickness | Thin Film Optical Measurement | ||
EML | MA-4 | Photo | Expose | Contact Lithography Mask Aligner | ||
EML | photo-hood-EML | Wet | Solvents | Solvent Fume hood for lithography | ||
EML | SolventHood-EML | Wet | Solvents | Solvent Fume hood for lithography | ||
ICL | asher-ICL | Photo | Clean | Single wafer oxygen plasma for photoresist removal | ||
ICL | pTrack | Photo | Coat | Automated coater and developer track | ||
ICL | eBeam-EVO | Deposition | Evaporate | Metal evaporator of CMOS compatible metals | ||
ICL | i-stepper | Photo | Expose | i-line stepper | ||
ICL | premetal-Piranha | Wet | Acids | Piranha resist removal and cleaning station | ||
ICL | UV1280 | Metrology | Thickness | Thin film characterization | ||
MTL | Procedures-Cleaning | Procedures | Clean | Sample Cleaning | ||
MTL | Procedures-General | Procedures | General | Broader concepts | ||
MTL | Procedures-Lithography | Procedures | Photo | Lithography | ||
TRL | acid-hood | Wet | Acids | Acid processing station | ||
TRL | asherMatrix-TRL | Photo | Clean | Single wafer oxygen plasma for photoresist removal | ||
TRL | asher-TRL | Photo | Clean | Barrel asher for resist removal | ||
TRL | coater | Photo | Coat | Manual spin-coater for photoresists | ||
TRL | develop-Brewer | Photo | Coat | Resist develop and postbake | ||
TRL | eBeamAu | Deposition | Evaporate | Metal evaporator | ||
TRL | eBeamFP | Deposition | Evaporate | Fast pumping metal evaporator | ||
TRL | ellipsometer-TRL | Metrology | Thickness | Thin film thickness measurement | ||
TRL | EV1 | Photo | Expose | Contact mask aligner | ||
TRL | EV-LC | Photo | Expose | Contact mask aligner | ||
TRL | Filmetrics-TRL | Metrology | Thickness | Thin film thickness measurement | ||
TRL | Greenflo | Wet | Acids | Acid processing station | ||
TRL | Heidelberg | Photo | Expose | Laser direct-write exposure for wafers and masks | ||
TRL | hotplate1 | Photo | Bake | Hotplate for lithography | ||
TRL | hotplate2 | Photo | Bake | Hotplate for lithography | ||
TRL | hotplate300 | Photo | Bake | Hotplate for lithography | ||
TRL | MA-6 | Photo | Expose | Contact mask aligner | ||
TRL | MLA-150 | Photo | Expose | Direct-write lithography for wafers and larger pieces | ||
TRL | nanospec | Metrology | Thickness | Thin film thickness measurement | ||
TRL | OAI-Flood | Photo | Expose | Flood exposure for image reversal resists | ||
TRL | photo-wet-Au | Wet | Solvents | Solvent fume hood with sonicator | ||
TRL | photo-wet-l | Wet | Solvents | Wetbench for photoresist development | ||
TRL | photo-wet-r | Wet | Solvents | Wetbench for photoresist development | ||
TRL | PMMAspinner | Photo | Coat | Manual coater for PMMA and other photoresists | ||
TRL | postbake | Photo | Bake | Bake oven 120C | ||
TRL | prebakeovn | Photo | Bake | Bake oven 90C | ||
TRL | Resonetics | Photo | Expose | Laser ablation system | ||
TRL | SolventHood-TRL | Wet | Solvents | Solvent fume hood | ||
TRL | varTemp | Photo | Bake | Bake oven for variable temperature |