Equipment
Lab and Coral NameMTL / Procedures-Lithography
Modeln/a
SpecialistKristofor Payer    (Paul Tierney)
Physical LocationWeb
Classification
Process CategoryProcedures
SubcategoryPhoto
Material KeywordsPolyimide, SU8, Other Polymers, Photoresist, EBL Resist, Developer
Sample SizeNone
Alternative?
KeywordsNone
Description
This page captures a broader set of procedures that relate to lithography.

Best for
Limitations
Characteristics/FOM
Caution with
Machine Chargesno charge
Documents

Documents
HMDS OvenApplication Note describing HMDS procedures
AZ5214EDatasheet for AZ5214E image reversal resist
AZ4620Datasheet for AZ4620 thick resist
PhotoresistApplication Note describing photoresist chemistry
Liftoff ResistApplication Note describing liftoff resists
Image reversalApplication Note describing image reversal
CoatingApplication Note describing spincoating
Developing ResistApplication Note describing resist development
HD4100Datasheet for HD4100 polyimide
maN2400Datasheet for maN2400 e-beam resist

External Links
GuideMicroChem Application Notes
Process Matrix Details

Permitted


Not Allowed
Ever been in EMLSamples from EML are never permitted to return to ICL or TRL


For more details or help, please consult PTC matrix, email ptc@mtl.mit.edu, or ask the research specialist (Kristofor Payer)