+ | EML |
acid-hood-EML
| Wet | Solvents
| General Purpose Acid Fume-Hood
| EML
|
+ | EML |
anneal-furnace
| Diffusion | Bake
| Anneal Furnace
| EML
|
+ | EML |
Box-Furnace
| Diffusion | Bake
| Anneal Furnace
| EML
|
+ | EML |
filmetrics
| Metrology | Thickness
| Thin Film Optical Measurement
| EML
|
+ | EML |
OxidationTube
| Diffusion | Oxidation
| Oxidation Furnace
| EML
|
+ | EML |
plasmatherm
| Deposition, Etch | PECVD, RIE
| Plasma Etch and Deposition
| EML
|
+ | EML |
RTA-EML
| Diffusion | Bake
| Rapid Thermal Annealing
| EML
|
+ | ICL |
5A-GateOx
| Diffusion | Oxidation
| Diffusion tube for gate oxide growth
| Green
|
+ | ICL |
5B-Anneal
| Diffusion | Bake
| Annealing tube
| Green
|
+ | ICL |
5C-FieldOx
| Diffusion | Oxidation
| Diffusion tube for wet oxide growth of thicker films
| Green
|
+ | ICL |
5D-ThickOx
| Diffusion | Oxidation
| Diffusion tube for wet oxide growth of thicker films
| Green
|
+ | ICL |
6C-LTO
| Diffusion | CVD
| Low temperature CVD oxide deposition
| Green
|
+ | ICL |
AME5000
| Etch | RIE
| RIE etcher for frontend silicon processes
| Green
|
+ | ICL |
concept1
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, and TEOS
| Green
|
+ | ICL |
DCVD
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, and a-Si
| Green
|
+ | ICL |
GnP
| Wet | Other
| Chemical Mechanical Polishing to planarize surfaces
| Red &Green
|
+ | ICL |
LAM490B
| Etch | RIE
| Chlorine based plasma etching of silicon
| Green
|
+ | ICL |
LAM590-ICL
| Etch | RIE
| Fluorine based plasma etching of silicon oxide and nitrides
| Green
|
+ | ICL |
oxEtch-BOE
| Wet | Acids
| Silicon dioxide etch bath
| Green
|
+ | ICL |
Oxford-100_PECVD
| Deposition, Etch | PECVD
| Dual chamber PECVD and plasma etch tool
| Red
|
+ | ICL |
Oxford-100_Etch
| Deposition, Etch | RIE
| Dual chamber PECVD and plasma etch tool
| Red
|
+ | ICL |
rca-ICL
| Diffusion | Clean
| Wafer cleaning before diffusion tubes
| Green
|
+ | ICL |
UV1280
| Metrology | Thickness
| Thin film characterization
| Green
|
| MTL |
Procedures-Deposition
| Procedures | Deposit
| Deposition of thin films
| Red &Green
|
| MTL |
Procedures-Etching
| Procedures | Etch
| Etching of materials
| Red &Green
|
| MTL |
Procedures-Metrology
| Procedures | Metrology
| Test and Measurement
| Red &Green
|
+ | TRL |
A1-GateOx
| Diffusion | Oxidation
| Thermal Oxidation for Green Silicon Wafers
| Green
|
+ | TRL |
A2-WetOxBond
| Diffusion | Oxidation
| Thermal Oxidation and other thermal process for GREEN Si wafers
| Green
|
+ | TRL |
A3-Sinter
| Diffusion | Bake
| Sintering for GREEN Si wafers
| Green
|
+ | TRL |
acid-hood
| Wet | Acids
| Acid processing station
| Red &Green
|
+ | TRL |
B2-Ox-alloy-Poly
| Diffusion | Oxidation
| Thermal Oxidation and LPCVD Polysilicon for RED wafers
| Green
|
+ | TRL |
B3-DryOx
| Diffusion | Oxidation
| Thermal Oxidation
| Green
|
+ | TRL |
ellipsometer-TRL
| Metrology | Thickness
| Thin film thickness measurement
| Red &Green
|
+ | TRL |
Filmetrics-TRL
| Metrology | Thickness
| Thin film thickness measurement
| Red &Green
|
+ | TRL |
Greenflo
| Wet | Acids
| Acid processing station
| Red &Green
|
+ | TRL |
HMDS-TRL
| Photo | Bake
| HMDS oven
| Red &Green
|
+ | TRL |
LAM590-TRL
| Etch | RIE
| Fluorine based plasma etching of oxide and nitrides
| Red
|
+ | TRL |
nanospec
| Metrology | Thickness
| Thin film thickness measurement
| Red &Green
|
+ | TRL |
plasmaquest
| Etch | RIE
| Fluorine and Chlorine general purpose plasma deposition and etch tool
| Red
|
+ | TRL |
sts-CVD
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, a-Si, SiC, and P-doped a-Si
| Red
|