Machines by Sample Size: 4
Process | Lab | Tool | Keywords | 0 | Description | |
---|---|---|---|---|---|---|
EBL | Elionix | ERRORERROR | Electron beam lithography system | |||
EML | acid-hood-EML | ERRORERROR | General Purpose Acid Fume-Hood | |||
EML | ALD-EML | ERRORERROR | Atomic Layer Deposition | |||
EML | anneal-furnace | ERRORERROR | Anneal Furnace | |||
EML | asher-EML | ERRORERROR | Oxygen Plasma | |||
EML | Box-Furnace | ERRORERROR | Anneal Furnace | |||
EML | coater-EML | ERRORERROR | Photoresist Coater | |||
EML | dektak-EML | ERRORERROR | Surface Profilerometer | |||
EML | eBeam-AJA | ERRORERROR | Metal and dielectric evaporator | |||
EML | filmetrics | ERRORERROR | Thin Film Optical Measurement | |||
EML | MA-4 | ERRORERROR | Contact Lithography Mask Aligner | |||
EML | OxidationTube | ERRORERROR | Oxidation Furnace | |||
EML | parametric-tester | ERRORERROR | Probe station for electrical measurements | |||
EML | photo-hood-EML | ERRORERROR | Solvent Fume hood for lithography | |||
EML | plasmatherm | ERRORERROR | Plasma Etch and Deposition | |||
EML | RTA-EML | ERRORERROR | Rapid Thermal Annealing | |||
EML | SolventHood-EML | ERRORERROR | Solvent Fume hood for lithography | |||
EML | SputtererAJA | ERRORERROR | Sputter deposition tool | |||
EML | vac-oven | ERRORERROR | Temperature controlled vacuum oven | |||
TRL | 2Dtransfer-platingHood | ERRORERROR | Electroplating wet bench and fume hood | |||
ICL | 5A-GateOx | ERRORERROR | Diffusion tube for gate oxide growth | |||
ICL | 5B-Anneal | ERRORERROR | Annealing tube | |||
ICL | 5C-FieldOx | ERRORERROR | Diffusion tube for wet oxide growth of thicker films | |||
ICL | 5D-ThickOx | ERRORERROR | Diffusion tube for wet oxide growth of thicker films | |||
ICL | 6A-nPoly | ERRORERROR | Polysilicon deposition tube for n-type poly Si | |||
ICL | 6B-Poly | ERRORERROR | Polysilicon deposition tube for p-type poly Si | |||
ICL | 6C-LTO | ERRORERROR | Low temperature CVD oxide deposition | |||
ICL | 6D-Nitride | ERRORERROR | Deposition of stoichiometric silicon nitride | |||
ICL | AFM | ERRORERROR | Atomic Force Microscope for Surface Analysis | |||
ICL | ALD | ERRORERROR | Atomic Layer Deposition | |||
ICL | ALD-Oxford | ERRORERROR | Atomic Layer Deposition | |||
ICL | asher-ICL | ERRORERROR | Single wafer oxygen plasma for photoresist removal | |||
ICL | diesaw | ERRORERROR | Wafer dicing saw | |||
ICL | diesaw-3240 | ERRORERROR | Wafer dicing saw | |||
ICL | eBeam-EVO | ERRORERROR | Metal evaporator of CMOS compatible metals | |||
ICL | GnP | ERRORERROR | Chemical Mechanical Polishing to planarize surfaces | |||
ICL | goldwire | ERRORERROR | Gold ball bonder for device packaging | |||
ICL | i-stepper | ERRORERROR | i-line stepper | |||
ICL | nitrEtch-HotPhos | ERRORERROR | Hot phosphoric nitride etch bath | |||
ICL | oxEtch-BOE | ERRORERROR | Silicon dioxide etch bath | |||
ICL | Oxford-100_PECVD | ERRORERROR | Dual chamber PECVD and plasma etch tool | |||
ICL | Oxford-100_Etch | ERRORERROR | Dual chamber PECVD and plasma etch tool | |||
ICL | premetal-Piranha | ERRORERROR | Piranha resist removal and cleaning station | |||
ICL | rca-ICL | ERRORERROR | Wafer cleaning before diffusion tubes | |||
ICL | RTA2 | ERRORERROR | Rapid Thermal Annealing | |||
ICL | RTA-pieces | ERRORERROR | Rapid Thermal Annealing | |||
ICL | RTP | ERRORERROR | Rapid Thermal Annealing | |||
ICL | RTP-Si | ERRORERROR | Rapid Thermal Annealing | |||
ICL | semZeiss | ERRORERROR | Scanning Electron Microscope | |||
ICL | TMAH-KOHhood | ERRORERROR | Silicon bulk wet etching | |||
ICL | UV1280 | ERRORERROR | Thin film characterization | |||
ICL | VTR | ERRORERROR | Low stress silicon nitride deposition | |||
ICL | wykoICL | ERRORERROR | Optical profiling system | |||
TRL | A1-GateOx | ERRORERROR | Thermal Oxidation for Green Silicon Wafers | |||
TRL | A2-WetOxBond | ERRORERROR | Thermal Oxidation and other thermal process for GREEN Si wafers | |||
TRL | A3-Sinter | ERRORERROR | Sintering for GREEN Si wafers | |||
TRL | A4-III-Vanneal | ERRORERROR | Annealing for GREEN III-V samples | |||
TRL | acid-hood | ERRORERROR | Acid processing station | |||
TRL | AJA-TRL | ERRORERROR | Sputter deposition tool | |||
TRL | asher-TRL | ERRORERROR | Barrel asher for resist removal | |||
TRL | B1-Au | ERRORERROR | Gold compatible anneal tube | |||
TRL | B2-Ox-alloy-Poly | ERRORERROR | Thermal Oxidation and LPCVD Polysilicon for RED wafers | |||
TRL | B3-DryOx | ERRORERROR | Thermal Oxidation | |||
TRL | B4-Poly | ERRORERROR | LPCVD polysilicon for Green wafers | |||
TRL | CCNT | ERRORERROR | Carbon nanotube growth | |||
TRL | coater | ERRORERROR | Manual spin-coater for photoresists | |||
TRL | dek-NoAu | ERRORERROR | Stylus Profilerometer | |||
TRL | dektak-XT | ERRORERROR | Stylus Profilerometer | |||
TRL | develop-Brewer | ERRORERROR | Resist develop and postbake | |||
TRL | eBeamAu | ERRORERROR | Metal evaporator | |||
TRL | eBeamFP | ERRORERROR | Fast pumping metal evaporator | |||
TRL | ellipsometer-TRL | ERRORERROR | Thin film thickness measurement | |||
TRL | EV1 | ERRORERROR | Contact mask aligner | |||
TRL | EV501 | ERRORERROR | Bonder system to apply heat, vacuum and pressure | |||
TRL | EV620 | ERRORERROR | Aligner for bonding | |||
TRL | EV-LC | ERRORERROR | Contact mask aligner | |||
TRL | Filmetrics-TRL | ERRORERROR | Thin film thickness measurement | |||
TRL | FLX | ERRORERROR | Thin film stress measurement | |||
TRL | Greenflo | ERRORERROR | Acid processing station | |||
TRL | Hall-probe | ERRORERROR | Carrier measurement | |||
TRL | Heidelberg | ERRORERROR | Laser direct-write exposure for wafers and masks | |||
TRL | HMDS-TRL | ERRORERROR | HMDS oven | |||
TRL | hotplate1 | ERRORERROR | Hotplate for lithography | |||
TRL | hotplate2 | ERRORERROR | Hotplate for lithography | |||
TRL | hotplate300 | ERRORERROR | Hotplate for lithography | |||
TRL | IV-probe | ERRORERROR | Probe station with curve tracer for IV measurement | |||
TRL | MA-6 | ERRORERROR | Contact mask aligner | |||
TRL | MLA-150 | ERRORERROR | Direct-write lithography for wafers and larger pieces | |||
TRL | nanospec | ERRORERROR | Thin film thickness measurement | |||
TRL | OAI-Flood | ERRORERROR | Flood exposure for image reversal resists | |||
TRL | parylene | ERRORERROR | Parylene depopsition | |||
TRL | photo-wet-Au | ERRORERROR | Solvent fume hood with sonicator | |||
TRL | photo-wet-l | ERRORERROR | Wetbench for photoresist development | |||
TRL | photo-wet-r | ERRORERROR | Wetbench for photoresist development | |||
TRL | plasmaquest | ERRORERROR | Fluorine and Chlorine general purpose plasma deposition and etch tool | |||
TRL | PMMAspinner | ERRORERROR | Manual coater for PMMA and other photoresists | |||
TRL | postbake | ERRORERROR | Bake oven 120C | |||
TRL | prebakeovn | ERRORERROR | Bake oven 90C | |||
TRL | PZTcoater | ERRORERROR | Coater to apply PZT films | |||
TRL | PZTfurnace | ERRORERROR | Bake oven for PZT coated wafers | |||
TRL | rca-TRL | ERRORERROR | Wafer cleaning before diffusion tubes | |||
TRL | Resonetics | ERRORERROR | Laser ablation system | |||
TRL | RTA-HiT | ERRORERROR | Rapid Thermal Annealing | |||
TRL | SAMCO | ERRORERROR | Chlorine based plasma etcher for III-V materials | |||
TRL | SolventHood-TRL | ERRORERROR | Solvent fume hood | |||
TRL | sts-CVD | ERRORERROR | PECVD deposition of oxides, nitrides, a-Si, SiC, and P-doped a-Si | |||
TRL | SU8spinner | ERRORERROR | Manual spin-coater for SU8 resists | |||
TRL | TBM-8 | ERRORERROR | Front-to-back alignement measurement | |||
TRL | UVozone-Au | ERRORERROR | Cleans residual organics | |||
TRL | varTemp | ERRORERROR | Bake oven for variable temperature | |||
TRL | WYKO | ERRORERROR | Optical profiling system | |||
TRL | XeF2 | ERRORERROR | XeF2 isotropic etching of silicon | |||
LEAP | X-rayInspection | ERRORERROR | X-Ray imaging | |||
LEAP | PlasmaCleaner | ERRORERROR | Plasma parts cleaning | |||
LEAP | ReflowOven | ERRORERROR | Reflow oven | |||
LEAP | QuickVisionMicroscope | ERRORERROR | Automated imaging microscope |