The standard wafer size at MTL is 6" wafers (150mm). However, many users process smaller samples, and this
is indicated by the sample size attribute. But, especially when processing pieces, be aware of special requirements
for the tool you're using. For example, placing a piece on a handle wafer may be acceptable for some tools
(e.g. STS-CVD), while it can cause problems for your sample in other tools (e.g. LAM-590-TRL). Thus, check with the
staff about the best practices for each tool.
| Attribute | Description | Tool List |
| 4" Wafers
| 100 mm (4") wafers
| Elionix,acid-hood-EML,ALD-EML,anneal-furnace,asher-EML,Box-Furnace,coater-EML,dektak-EML,eBeam-AJA,filmetrics,MA-4,OxidationTube,parametric-tester,photo-hood-EML,plasmatherm,RTA-EML,SolventHood-EML,SputtererAJA,vac-oven,2Dtransfer-platingHood,5A-GateOx,5B-Anneal,5C-FieldOx,5D-ThickOx,6A-nPoly,6B-Poly,6C-LTO,6D-Nitride,AFM,ALD,ALD-Oxford,asher-ICL,diesaw,diesaw-3240,eBeam-EVO,GnP,goldwire,i-stepper,nitrEtch-HotPhos,oxEtch-BOE,Oxford-100_PECVD,Oxford-100_Etch,premetal-Piranha,rca-ICL,RTA2,RTA-pieces,RTP,RTP-Si,semZeiss,TMAH-KOHhood,UV1280,VTR,wykoICL,A1-GateOx,A2-WetOxBond,A3-Sinter,A4-III-Vanneal,acid-hood,AJA-TRL,asher-TRL,B1-Au,B2-Ox-alloy-Poly,B3-DryOx,B4-Poly,CCNT,coater,dek-NoAu,dektak-XT,develop-Brewer,eBeamAu,eBeamFP,ellipsometer-TRL,EV1,EV501,EV620,EV-LC,Filmetrics-TRL,FLX,Greenflo,Hall-probe,Heidelberg,HMDS-TRL,hotplate1,hotplate2,hotplate300,IV-probe,MA-6,MLA-150,nanospec,OAI-Flood,parylene,photo-wet-Au,photo-wet-l,photo-wet-r,plasmaquest,PMMAspinner,postbake,prebakeovn,PZTcoater,PZTfurnace,rca-TRL,Resonetics,RTA-HiT,SAMCO,SolventHood-TRL,sts-CVD,SU8spinner,TBM-8,UVozone-Au,varTemp,WYKO,XeF2,X-rayInspection,PlasmaCleaner,ReflowOven,QuickVisionMicroscope,
|
| 5" Photo Plates
| 5" square glass plates (4" wafer photomask)
| Elionix,acid-hood-EML,photo-hood-EML,SolventHood-EML,wykoICL,acid-hood,dek-NoAu,dektak-XT,develop-Brewer,ellipsometer-TRL,Filmetrics-TRL,Greenflo,Heidelberg,IV-probe,MLA-150,nanospec,photo-wet-Au,photo-wet-l,photo-wet-r,SolventHood-TRL,TBM-8,varTemp,WYKO,X-rayInspection,PlasmaCleaner,ReflowOven,QuickVisionMicroscope,
|
| 6" Wafers
| 150 mm (6") wafers (the standard size in MTL)
| Elionix,acid-hood-EML,ALD-EML,Box-Furnace,coater-EML,dektak-EML,eBeam-AJA,filmetrics,parametric-tester,photo-hood-EML,plasmatherm,SolventHood-EML,SputtererAJA,vac-oven,2Dtransfer-platingHood,4-pt-probe,5A-GateOx,5B-Anneal,5C-FieldOx,5D-ThickOx,6A-nPoly,6B-Poly,6C-LTO,6D-Nitride,AFM,ALD,ALD-Oxford,AME5000,asher-ICL,pTrack,concept1,cv,DCVD,diesaw,diesaw-3240,eBeam-EVO,endura,epi-Centura,GnP,goldwire,i-stepper,LAM490B,LAM590-ICL,nitrEtch-HotPhos,oxEtch-BOE,Oxford-100_PECVD,Oxford-100_Etch,P10,premetal-Piranha,rainbow,rca-ICL,RTA2,RTA-pieces,RTP,RTP-Si,semZeiss,SM-300,TMAH-KOHhood,UV1280,VTR,wykoICL,A1-GateOx,A2-WetOxBond,A3-Sinter,A4-III-Vanneal,acid-hood,AJA-TRL,asherMatrix-TRL,asher-TRL,B1-Au,B2-Ox-alloy-Poly,B3-DryOx,B4-Poly,CCNT,coater,dek-NoAu,dektak-XT,develop-Brewer,eBeamAu,eBeamFP,ellipsometer-TRL,EV1,EV501,EV620,EV-LC,Filmetrics-TRL,FLX,Greenflo,Hall-probe,Heidelberg,HMDS-TRL,hotplate1,hotplate2,hotplate300,IV-probe,LAM590-TRL,MA-6,MLA-150,nanospec,OAI-Flood,parylene,photo-wet-Au,photo-wet-l,photo-wet-r,PMMAspinner,postbake,prebakeovn,PZTcoater,PZTfurnace,rca-TRL,Resonetics,RTA-HiT,SAMCO,SolventHood-TRL,sts1,sts2,sts-CVD,sts-Pegasus,SU8spinner,TBM-8,UVozone-Au,varTemp,WYKO,XeF2,X-rayInspection,PlasmaCleaner,ReflowOven,QuickVisionMicroscope,
|
| 7" Photo Plates
| 7" square glass plates (6" wafer photomask)
| Elionix,acid-hood-EML,photo-hood-EML,SolventHood-EML,wykoICL,acid-hood,dek-NoAu,dektak-XT,develop-Brewer,ellipsometer-TRL,Filmetrics-TRL,Greenflo,Heidelberg,IV-probe,MLA-150,nanospec,photo-wet-Au,photo-wet-l,photo-wet-r,SolventHood-TRL,TBM-8,varTemp,WYKO,X-rayInspection,QuickVisionMicroscope,
|
| 8" Wafers
| 200 mm (8") wafers
| Elionix,wykoICL,Filmetrics-TRL,Heidelberg,IV-probe,MLA-150,photo-wet-Au,photo-wet-l,photo-wet-r,SolventHood-TRL,varTemp,WYKO,X-rayInspection,QuickVisionMicroscope,
|
| None
| No sample size
| Procedures-Cleaning,Procedures-Deposition,Procedures-Etching,Procedures-General,Procedures-Lithography,Procedures-Metrology,SU8oven,OutsideLab,CNS,NSL,SNL,
|
| Pieces
| Pieces of various sizes and shapes
| Elionix,acid-hood-EML,ALD-EML,anneal-furnace,asher-EML,BalzerSputterer,Box-Furnace,coater-EML,dektak-EML,eBeam-AJA,filmetrics,hotpress,MA-4,OxidationTube,parametric-tester,photo-hood-EML,plasmatherm,RTA-EML,semNeo,SolventHood-EML,SputtererAJA,vac-oven,2Dtransfer-platingHood,AFM,ALD,ALD-Oxford,diesaw,diesaw-3240,eBeam-EVO,goldwire,Oxford-100_PECVD,Oxford-100_Etch,semZeiss,TMAH-KOHhood,wykoICL,acid-hood,AJA-TRL,asher-TRL,Balzer-Elionix,CCNT,coater,dek-NoAu,dektak-XT,eBeamAu,eBeamFP,ellipsometer-TRL,EV1,EV501,EV620,EV-LC,Filmetrics-TRL,Greenflo,Hall-probe,Heidelberg,HMDS-TRL,hotplate1,hotplate2,hotplate300,IV-probe,MA-6,MLA-150,nanospec,OAI-Flood,parylene,photo-wet-Au,photo-wet-l,photo-wet-r,plasmaquest,PMMAspinner,postbake,prebakeovn,PZTcoater,PZTfurnace,Resonetics,RTA-HiT,SAMCO,SolventHood-TRL,sts-CVD,SU8spinner,TBM-8,UVozone-Au,varTemp,WYKO,XeF2,AutoBonder,BallBonder,WedgeBonder,X-rayInspection,DieBonder,PlasmaCleaner,ReflowOven,QuickVisionMicroscope,
|
| Pieces Require Puck
| Pieces with special puck for a tool
| concept1,endura,GnP,i-stepper,LAM490B,LAM590-ICL,rainbow,RTA2,RTA-pieces,RTP,RTP-Si,UV1280,VTR,asherMatrix-TRL,LAM590-TRL,sts1,sts2,sts-Pegasus,
|