The standard wafer size at MTL is 6" wafers (150mm). However, many users process smaller samples, and this is indicated by the sample size attribute. But, especially when processing pieces, be aware of special requirements for the tool you're using. For example, placing a piece on a handle wafer may be acceptable for some tools (e.g. STS-CVD), while it can cause problems for your sample in other tools (e.g. LAM-590-TRL). Thus, check with the staff about the best practices for each tool.

Attribute	Description	Tool List
4" Wafers	100 mm (4") wafers	Elionix,acid-hood-EML,ALD-EML,anneal-furnace,asher-EML,Box-Furnace,coater-EML,dektak-EML,eBeam-AJA,filmetrics,MA-4,OxidationTube,parametric-tester,photo-hood-EML,plasmatherm,RTA-EML,SolventHood-EML,SputtererAJA,vac-oven,2Dtransfer-platingHood,5A-GateOx,5B-Anneal,5C-FieldOx,5D-ThickOx,6A-nPoly,6B-Poly,6C-LTO,6D-Nitride,AFM,ALD,ALD-Oxford,asher-ICL,diesaw,diesaw-3240,eBeam-EVO,GnP,goldwire,i-stepper,nitrEtch-HotPhos,oxEtch-BOE,Oxford-100_PECVD,Oxford-100_Etch,premetal-Piranha,rca-ICL,RTA2,RTA-pieces,RTP,RTP-Si,semZeiss,TMAH-KOHhood,UV1280,VTR,wykoICL,A1-GateOx,A2-WetOxBond,A3-Sinter,A4-III-Vanneal,acid-hood,AJA-TRL,asher-TRL,B1-Au,B2-Ox-alloy-Poly,B3-DryOx,B4-Poly,CCNT,coater,dek-NoAu,dektak-XT,develop-Brewer,eBeamAu,eBeamFP,ellipsometer-TRL,EV1,EV501,EV620,EV-LC,Filmetrics-TRL,FLX,Greenflo,Hall-probe,Heidelberg,HMDS-TRL,hotplate1,hotplate2,hotplate300,IV-probe,MA-6,MLA-150,nanospec,OAI-Flood,parylene,photo-wet-Au,photo-wet-l,photo-wet-r,plasmaquest,PMMAspinner,postbake,prebakeovn,PZTcoater,PZTfurnace,rca-TRL,Resonetics,RTA-HiT,SAMCO,SolventHood-TRL,sts-CVD,SU8spinner,TBM-8,UVozone-Au,varTemp,WYKO,XeF2,X-rayInspection,PlasmaCleaner,ReflowOven,QuickVisionMicroscope,
5" Photo Plates	5" square glass plates (4" wafer photomask)	Elionix,acid-hood-EML,photo-hood-EML,SolventHood-EML,wykoICL,acid-hood,dek-NoAu,dektak-XT,develop-Brewer,ellipsometer-TRL,Filmetrics-TRL,Greenflo,Heidelberg,IV-probe,MLA-150,nanospec,photo-wet-Au,photo-wet-l,photo-wet-r,SolventHood-TRL,TBM-8,varTemp,WYKO,X-rayInspection,PlasmaCleaner,ReflowOven,QuickVisionMicroscope,
6" Wafers	150 mm (6") wafers (the standard size in MTL)	Elionix,acid-hood-EML,ALD-EML,Box-Furnace,coater-EML,dektak-EML,eBeam-AJA,filmetrics,parametric-tester,photo-hood-EML,plasmatherm,SolventHood-EML,SputtererAJA,vac-oven,2Dtransfer-platingHood,4-pt-probe,5A-GateOx,5B-Anneal,5C-FieldOx,5D-ThickOx,6A-nPoly,6B-Poly,6C-LTO,6D-Nitride,AFM,ALD,ALD-Oxford,AME5000,asher-ICL,pTrack,concept1,cv,DCVD,diesaw,diesaw-3240,eBeam-EVO,endura,epi-Centura,GnP,goldwire,i-stepper,LAM490B,LAM590-ICL,nitrEtch-HotPhos,oxEtch-BOE,Oxford-100_PECVD,Oxford-100_Etch,P10,premetal-Piranha,rainbow,rca-ICL,RTA2,RTA-pieces,RTP,RTP-Si,semZeiss,SM-300,TMAH-KOHhood,UV1280,VTR,wykoICL,A1-GateOx,A2-WetOxBond,A3-Sinter,A4-III-Vanneal,acid-hood,AJA-TRL,asherMatrix-TRL,asher-TRL,B1-Au,B2-Ox-alloy-Poly,B3-DryOx,B4-Poly,CCNT,coater,dek-NoAu,dektak-XT,develop-Brewer,eBeamAu,eBeamFP,ellipsometer-TRL,EV1,EV501,EV620,EV-LC,Filmetrics-TRL,FLX,Greenflo,Hall-probe,Heidelberg,HMDS-TRL,hotplate1,hotplate2,hotplate300,IV-probe,LAM590-TRL,MA-6,MLA-150,nanospec,OAI-Flood,parylene,photo-wet-Au,photo-wet-l,photo-wet-r,PMMAspinner,postbake,prebakeovn,PZTcoater,PZTfurnace,rca-TRL,Resonetics,RTA-HiT,SAMCO,SolventHood-TRL,sts1,sts2,sts-CVD,sts-Pegasus,SU8spinner,TBM-8,UVozone-Au,varTemp,WYKO,XeF2,X-rayInspection,PlasmaCleaner,ReflowOven,QuickVisionMicroscope,
7" Photo Plates	7" square glass plates (6" wafer photomask)	Elionix,acid-hood-EML,photo-hood-EML,SolventHood-EML,wykoICL,acid-hood,dek-NoAu,dektak-XT,develop-Brewer,ellipsometer-TRL,Filmetrics-TRL,Greenflo,Heidelberg,IV-probe,MLA-150,nanospec,photo-wet-Au,photo-wet-l,photo-wet-r,SolventHood-TRL,TBM-8,varTemp,WYKO,X-rayInspection,QuickVisionMicroscope,
8" Wafers	200 mm (8") wafers	Elionix,wykoICL,Filmetrics-TRL,Heidelberg,IV-probe,MLA-150,photo-wet-Au,photo-wet-l,photo-wet-r,SolventHood-TRL,varTemp,WYKO,X-rayInspection,QuickVisionMicroscope,
None	No sample size	Procedures-Cleaning,Procedures-Deposition,Procedures-Etching,Procedures-General,Procedures-Lithography,Procedures-Metrology,SU8oven,OutsideLab,CNS,NSL,SNL,
Pieces	Pieces of various sizes and shapes	Elionix,acid-hood-EML,ALD-EML,anneal-furnace,asher-EML,BalzerSputterer,Box-Furnace,coater-EML,dektak-EML,eBeam-AJA,filmetrics,hotpress,MA-4,OxidationTube,parametric-tester,photo-hood-EML,plasmatherm,RTA-EML,semNeo,SolventHood-EML,SputtererAJA,vac-oven,2Dtransfer-platingHood,AFM,ALD,ALD-Oxford,diesaw,diesaw-3240,eBeam-EVO,goldwire,Oxford-100_PECVD,Oxford-100_Etch,semZeiss,TMAH-KOHhood,wykoICL,acid-hood,AJA-TRL,asher-TRL,Balzer-Elionix,CCNT,coater,dek-NoAu,dektak-XT,eBeamAu,eBeamFP,ellipsometer-TRL,EV1,EV501,EV620,EV-LC,Filmetrics-TRL,Greenflo,Hall-probe,Heidelberg,HMDS-TRL,hotplate1,hotplate2,hotplate300,IV-probe,MA-6,MLA-150,nanospec,OAI-Flood,parylene,photo-wet-Au,photo-wet-l,photo-wet-r,plasmaquest,PMMAspinner,postbake,prebakeovn,PZTcoater,PZTfurnace,Resonetics,RTA-HiT,SAMCO,SolventHood-TRL,sts-CVD,SU8spinner,TBM-8,UVozone-Au,varTemp,WYKO,XeF2,AutoBonder,BallBonder,WedgeBonder,X-rayInspection,DieBonder,PlasmaCleaner,ReflowOven,QuickVisionMicroscope,
Pieces Require Puck	Pieces with special puck for a tool	concept1,endura,GnP,i-stepper,LAM490B,LAM590-ICL,rainbow,RTA2,RTA-pieces,RTP,RTP-Si,UV1280,VTR,asherMatrix-TRL,LAM590-TRL,sts1,sts2,sts-Pegasus,

View by Attribute: Permitted Sample Size