Machines by Sample Size: Pieces Require Puck
| Process | Lab | Tool | Keywords | 0 | Description | |
|---|---|---|---|---|---|---|
| ICL | concept1 | ERRORERROR | PECVD deposition of oxides, nitrides, and TEOS | |||
| ICL | endura | ERRORERROR | Metal sputter deposition | |||
| ICL | GnP | ERRORERROR | Chemical Mechanical Polishing to planarize surfaces | |||
| ICL | i-stepper | ERRORERROR | i-line stepper | |||
| ICL | LAM490B | ERRORERROR | Chlorine based plasma etching of silicon | |||
| ICL | LAM590-ICL | ERRORERROR | Fluorine based plasma etching of silicon oxide and nitrides | |||
| ICL | rainbow | ERRORERROR | Chlorine based plasma etcher for metals | |||
| ICL | RTA2 | ERRORERROR | Rapid Thermal Annealing | |||
| ICL | RTA-pieces | ERRORERROR | Rapid Thermal Annealing | |||
| ICL | RTP | ERRORERROR | Rapid Thermal Annealing | |||
| ICL | RTP-Si | ERRORERROR | Rapid Thermal Annealing | |||
| ICL | UV1280 | ERRORERROR | Thin film characterization | |||
| ICL | VTR | ERRORERROR | Low stress silicon nitride deposition | |||
| TRL | asherMatrix-TRL | ERRORERROR | Single wafer oxygen plasma for photoresist removal | |||
| TRL | LAM590-TRL | ERRORERROR | Fluorine based plasma etching of oxide and nitrides | |||
| TRL | sts1 | ERRORERROR | Deep reactive ion etcher for silicon | |||
| TRL | sts2 | ERRORERROR | Deep reactive ion etcher for silicon | |||
| TRL | sts-Pegasus | ERRORERROR | Deep reactive ion etcher for silicon |