Machines by Material Keyword: GaN
| Process | Lab | Tool | Process Category | Subcategory | Description | |
|---|---|---|---|---|---|---|
| EML | acid-hood-EML | Wet | Solvents | General Purpose Acid Fume-Hood | ||
| EML | plasmatherm | Deposition, Etch | PECVD, RIE | Plasma Etch and Deposition | ||
| ICL | diesaw | Packaging | Physical | Wafer dicing saw | ||
| ICL | diesaw-3240 | Packaging | Physical | Wafer dicing saw | ||
| ICL | GnP | Wet | Other | Chemical Mechanical Polishing to planarize surfaces | ||
| ICL | rainbow | Etch | RIE | Chlorine based plasma etcher for metals | ||
| ICL | SM-300 | Metrology | Thickness | Thickness measurement for CMP processing | ||
| MTL | Procedures-Cleaning | Procedures | Clean | Sample Cleaning | ||
| MTL | Procedures-Etching | Procedures | Etch | Etching of materials | ||
| MTL | Procedures-Metrology | Procedures | Metrology | Test and Measurement | ||
| TRL | A4-III-Vanneal | Diffusion | Bake | Annealing for GREEN III-V samples | ||
| TRL | acid-hood | Wet | Acids | Acid processing station | ||
| TRL | develop-Brewer | Photo | Coat | Resist develop and postbake | ||
| TRL | Greenflo | Wet | Acids | Acid processing station | ||
| TRL | plasmaquest | Etch | RIE | Fluorine and Chlorine general purpose plasma deposition and etch tool | ||
| TRL | RTA-HiT | Diffusion | Bake | Rapid Thermal Annealing | ||
| TRL | SAMCO | Etch | RIE | Chlorine based plasma etcher for III-V materials |