Machines by General Keyword: multiple pieces
Process | Lab | Tool | Process Category | Subcategory | Description | |
---|---|---|---|---|---|---|
EBL | Elionix | Photo | Expose | Electron beam lithography system | ||
EML | acid-hood-EML | Wet | Solvents | General Purpose Acid Fume-Hood | ||
EML | ALD-EML | Deposition | CVD | Atomic Layer Deposition | ||
EML | anneal-furnace | Diffusion | Bake | Anneal Furnace | ||
EML | asher-EML | Photo | Clean | Oxygen Plasma | ||
EML | Box-Furnace | Diffusion | Bake | Anneal Furnace | ||
EML | eBeam-AJA | Deposition | Evaporate | Metal and dielectric evaporator | ||
EML | OxidationTube | Diffusion | Oxidation | Oxidation Furnace | ||
EML | photo-hood-EML | Wet | Solvents | Solvent Fume hood for lithography | ||
EML | RTA-EML | Diffusion | Bake | Rapid Thermal Annealing | ||
EML | SolventHood-EML | Wet | Solvents | Solvent Fume hood for lithography | ||
EML | SputtererAJA | Deposition | Sputter | Sputter deposition tool | ||
ICL | 5A-GateOx | Diffusion | Oxidation | Diffusion tube for gate oxide growth | ||
ICL | 5B-Anneal | Diffusion | Bake | Annealing tube | ||
ICL | 5C-FieldOx | Diffusion | Oxidation | Diffusion tube for wet oxide growth of thicker films | ||
ICL | 5D-ThickOx | Diffusion | Oxidation | Diffusion tube for wet oxide growth of thicker films | ||
ICL | 6A-nPoly | Diffusion | CVD | Polysilicon deposition tube for n-type poly Si | ||
ICL | 6B-Poly | Diffusion | CVD | Polysilicon deposition tube for p-type poly Si | ||
ICL | 6C-LTO | Diffusion | CVD | Low temperature CVD oxide deposition | ||
ICL | 6D-Nitride | Diffusion | CVD | Deposition of stoichiometric silicon nitride | ||
ICL | ALD | Deposition | CVD | Atomic Layer Deposition | ||
ICL | ALD-Oxford | Deposition | CVD, PECVD | Atomic Layer Deposition | ||
ICL | goldwire | Packaging | Physical | Gold ball bonder for device packaging | ||
ICL | Oxford-100_PECVD | Deposition, Etch | PECVD | Dual chamber PECVD and plasma etch tool | ||
ICL | Oxford-100_Etch | Deposition, Etch | RIE | Dual chamber PECVD and plasma etch tool | ||
ICL | RTA2 | Diffusion | Bake | Rapid Thermal Annealing | ||
ICL | RTA-pieces | Diffusion | Bake | Rapid Thermal Annealing | ||
ICL | semZeiss | Metrology | SEM | Scanning Electron Microscope | ||
ICL | TMAH-KOHhood | Wet | Acids | Silicon bulk wet etching | ||
TRL | A1-GateOx | Diffusion | Oxidation | Thermal Oxidation for Green Silicon Wafers | ||
TRL | A2-WetOxBond | Diffusion | Oxidation | Thermal Oxidation and other thermal process for GREEN Si wafers | ||
TRL | A3-Sinter | Diffusion | Bake | Sintering for GREEN Si wafers | ||
TRL | A4-III-Vanneal | Diffusion | Bake | Annealing for GREEN III-V samples | ||
TRL | acid-hood | Wet | Acids | Acid processing station | ||
TRL | asher-TRL | Photo | Clean | Barrel asher for resist removal | ||
TRL | B1-Au | Diffusion | Oxidation | Gold compatible anneal tube | ||
TRL | B2-Ox-alloy-Poly | Diffusion | Oxidation | Thermal Oxidation and LPCVD Polysilicon for RED wafers | ||
TRL | B3-DryOx | Diffusion | Oxidation | Thermal Oxidation | ||
TRL | B4-Poly | Diffusion | CVD | LPCVD polysilicon for Green wafers | ||
TRL | CCNT | Deposition | PECVD | Carbon nanotube growth | ||
TRL | eBeamAu | Deposition | Evaporate | Metal evaporator | ||
TRL | eBeamFP | Deposition | Evaporate | Fast pumping metal evaporator | ||
TRL | Greenflo | Wet | Acids | Acid processing station | ||
TRL | HMDS-TRL | Photo | Bake | HMDS oven | ||
TRL | hotplate1 | Photo | Bake | Hotplate for lithography | ||
TRL | hotplate2 | Photo | Bake | Hotplate for lithography | ||
TRL | hotplate300 | Photo | Bake | Hotplate for lithography | ||
TRL | photo-wet-Au | Wet | Solvents | Solvent fume hood with sonicator | ||
TRL | photo-wet-l | Wet | Solvents | Wetbench for photoresist development | ||
TRL | photo-wet-r | Wet | Solvents | Wetbench for photoresist development | ||
TRL | plasmaquest | Etch | RIE | Fluorine and Chlorine general purpose plasma deposition and etch tool | ||
TRL | postbake | Photo | Bake | Bake oven 120C | ||
TRL | prebakeovn | Photo | Bake | Bake oven 90C | ||
TRL | PZTfurnace | Deposition | Bake | Bake oven for PZT coated wafers | ||
TRL | RTA-HiT | Diffusion | Bake | Rapid Thermal Annealing | ||
TRL | SAMCO | Etch | RIE | Chlorine based plasma etcher for III-V materials | ||
TRL | SolventHood-TRL | Wet | Solvents | Solvent fume hood | ||
TRL | sts-CVD | Deposition | PECVD | PECVD deposition of oxides, nitrides, a-Si, SiC, and P-doped a-Si | ||
TRL | UVozone-Au | Etch | Clean | Cleans residual organics | ||
TRL | varTemp | Photo | Bake | Bake oven for variable temperature | ||
TRL | XeF2 | Etch | RIE | XeF2 isotropic etching of silicon |