| Attribute | Description | Tool List |
| EBL
| Electron Beam Lithography
| Elionix,
|
| EML
| Exploratory Materials Laboratory (5th floor)
| acid-hood-EML,ALD-EML,anneal-furnace,asher-EML,BalzerSputterer,Box-Furnace,coater-EML,dektak-EML,eBeam-AJA,filmetrics,hotpress,MA-4,OxidationTube,parametric-tester,photo-hood-EML,plasmatherm,RTA-EML,semNeo,SolventHood-EML,SputtererAJA,vac-oven,
|
| ICL
| Integrated Circuits Laboratory (2nd floor)
| 4-pt-probe,5A-GateOx,5B-Anneal,5C-FieldOx,5D-ThickOx,6A-nPoly,6B-Poly,6C-LTO,6D-Nitride,AFM,ALD,ALD-Oxford,AME5000,asher-ICL,pTrack,concept1,cv,DCVD,diesaw,diesaw-3240,eBeam-EVO,endura,epi-Centura,GnP,goldwire,i-stepper,LAM490B,LAM590-ICL,nitrEtch-HotPhos,oxEtch-BOE,Oxford-100_PECVD,Oxford-100_Etch,P10,premetal-Piranha,rainbow,rca-ICL,RTA2,RTA-pieces,RTP,RTP-Si,semZeiss,SM-300,TMAH-KOHhood,UV1280,VTR,wykoICL,
|
| MTL
| Microsystems Technology Laboratory (everything)
| Procedures-Cleaning,Procedures-Deposition,Procedures-Etching,Procedures-General,Procedures-Lithography,Procedures-Metrology,
|
| TRL
| Technology Research Laboratory (4th floor)
| 2Dtransfer-platingHood,A1-GateOx,A2-WetOxBond,A3-Sinter,A4-III-Vanneal,acid-hood,AJA-TRL,asherMatrix-TRL,asher-TRL,B1-Au,B2-Ox-alloy-Poly,B3-DryOx,B4-Poly,Balzer-Elionix,CCNT,coater,dek-NoAu,dektak-XT,develop-Brewer,eBeamAu,eBeamFP,ellipsometer-TRL,EV1,EV501,EV620,EV-LC,Filmetrics-TRL,FLX,Greenflo,Hall-probe,Heidelberg,HMDS-TRL,hotplate1,hotplate2,hotplate300,IV-probe,LAM590-TRL,MA-6,MLA-150,nanospec,OAI-Flood,parylene,photo-wet-Au,photo-wet-l,photo-wet-r,plasmaquest,PMMAspinner,postbake,prebakeovn,PZTcoater,PZTfurnace,rca-TRL,Resonetics,RTA-HiT,SAMCO,SolventHood-TRL,sts1,sts2,sts-CVD,sts-Pegasus,SU8oven,SU8spinner,TBM-8,UVozone-Au,varTemp,WYKO,XeF2,
|
| Other
| 0
| OutsideLab,CNS,NSL,SNL,
|
| LEAP
| LEAP Packaging
| AutoBonder,BallBonder,WedgeBonder,X-rayInspection,DieBonder,PlasmaCleaner,ReflowOven,QuickVisionMicroscope,
|