+ | EML |
anneal-furnace
| Diffusion | Bake
| Anneal Furnace
| EML
|
+ | EML |
Box-Furnace
| Diffusion | Bake
| Anneal Furnace
| EML
|
+ | EML |
OxidationTube
| Diffusion | Oxidation
| Oxidation Furnace
| EML
|
+ | ICL |
5A-GateOx
| Diffusion | Oxidation
| Diffusion tube for gate oxide growth
| Green
|
+ | ICL |
5B-Anneal
| Diffusion | Bake
| Annealing tube
| Green
|
+ | ICL |
5C-FieldOx
| Diffusion | Oxidation
| Diffusion tube for wet oxide growth of thicker films
| Green
|
+ | ICL |
5D-ThickOx
| Diffusion | Oxidation
| Diffusion tube for wet oxide growth of thicker films
| Green
|
+ | ICL |
6A-nPoly
| Diffusion | CVD
| Polysilicon deposition tube for n-type poly Si
| Green
|
+ | ICL |
6B-Poly
| Diffusion | CVD
| Polysilicon deposition tube for p-type poly Si
| Green
|
+ | ICL |
6C-LTO
| Diffusion | CVD
| Low temperature CVD oxide deposition
| Green
|
+ | ICL |
6D-Nitride
| Diffusion | CVD
| Deposition of stoichiometric silicon nitride
| Green
|
+ | ICL |
AME5000
| Etch | RIE
| RIE etcher for frontend silicon processes
| Green
|
+ | ICL |
asher-ICL
| Photo | Clean
| Single wafer oxygen plasma for photoresist removal
| Green
|
+ | ICL |
pTrack
| Photo | Coat
| Automated coater and developer track
| Green
|
+ | ICL |
concept1
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, and TEOS
| Green
|
+ | ICL |
DCVD
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, and a-Si
| Green
|
+ | ICL |
eBeam-EVO
| Deposition | Evaporate
| Metal evaporator of CMOS compatible metals
| Green
|
+ | ICL |
endura
| Deposition | Sputter
| Metal sputter deposition
| Green
|
+ | ICL |
epi-Centura
| Deposition | CVD
| Not open to public
| Green
|
+ | ICL |
i-stepper
| Photo | Expose
| i-line stepper
| Red &Green
|
+ | ICL |
LAM490B
| Etch | RIE
| Chlorine based plasma etching of silicon
| Green
|
+ | ICL |
LAM590-ICL
| Etch | RIE
| Fluorine based plasma etching of silicon oxide and nitrides
| Green
|
+ | ICL |
nitrEtch-HotPhos
| Wet | Acids
| Hot phosphoric nitride etch bath
| Green
|
+ | ICL |
oxEtch-BOE
| Wet | Acids
| Silicon dioxide etch bath
| Green
|
+ | ICL |
premetal-Piranha
| Wet | Acids
| Piranha resist removal and cleaning station
| Green
|
+ | ICL |
rainbow
| Etch | RIE
| Chlorine based plasma etcher for metals
| Green
|
+ | ICL |
rca-ICL
| Diffusion | Clean
| Wafer cleaning before diffusion tubes
| Green
|
+ | ICL |
RTP
| Diffusion | Bake
| Rapid Thermal Annealing
| Green
|
+ | ICL |
RTP-Si
| Diffusion | Bake
| Rapid Thermal Annealing
| Green
|
+ | ICL |
TMAH-KOHhood
| Wet | Acids
| Silicon bulk wet etching
| Red &Green
|
+ | ICL |
UV1280
| Metrology | Thickness
| Thin film characterization
| Green
|
+ | ICL |
VTR
| Diffusion | CVD
| Low stress silicon nitride deposition
| Green
|
+ | TRL |
A1-GateOx
| Diffusion | Oxidation
| Thermal Oxidation for Green Silicon Wafers
| Green
|
+ | TRL |
A2-WetOxBond
| Diffusion | Oxidation
| Thermal Oxidation and other thermal process for GREEN Si wafers
| Green
|
+ | TRL |
A3-Sinter
| Diffusion | Bake
| Sintering for GREEN Si wafers
| Green
|
+ | TRL |
A4-III-Vanneal
| Diffusion | Bake
| Annealing for GREEN III-V samples
| Red
|
+ | TRL |
acid-hood
| Wet | Acids
| Acid processing station
| Red &Green
|
+ | TRL |
asherMatrix-TRL
| Photo | Clean
| Single wafer oxygen plasma for photoresist removal
| Red
|
+ | TRL |
asher-TRL
| Photo | Clean
| Barrel asher for resist removal
| Red &Green
|
+ | TRL |
B1-Au
| Diffusion | Oxidation
| Gold compatible anneal tube
| Red
|
+ | TRL |
B2-Ox-alloy-Poly
| Diffusion | Oxidation
| Thermal Oxidation and LPCVD Polysilicon for RED wafers
| Green
|
+ | TRL |
B3-DryOx
| Diffusion | Oxidation
| Thermal Oxidation
| Green
|
+ | TRL |
B4-Poly
| Diffusion | CVD
| LPCVD polysilicon for Green wafers
| Green
|
+ | TRL |
eBeamAu
| Deposition | Evaporate
| Metal evaporator
| Red
|
+ | TRL |
eBeamFP
| Deposition | Evaporate
| Fast pumping metal evaporator
| Red
|
+ | TRL |
Greenflo
| Wet | Acids
| Acid processing station
| Red &Green
|
+ | TRL |
HMDS-TRL
| Photo | Bake
| HMDS oven
| Red &Green
|
+ | TRL |
LAM590-TRL
| Etch | RIE
| Fluorine based plasma etching of oxide and nitrides
| Red
|
+ | TRL |
postbake
| Photo | Bake
| Bake oven 120C
| Red &Green
|
+ | TRL |
prebakeovn
| Photo | Bake
| Bake oven 90C
| Red &Green
|
+ | TRL |
rca-TRL
| Diffusion | Clean
| Wafer cleaning before diffusion tubes
| Green
|
+ | TRL |
sts-Pegasus
| Etch | DRIE
| Deep reactive ion etcher for silicon
| Red
|
+ | TRL |
varTemp
| Photo | Bake
| Bake oven for variable temperature
| Red
|