Machines by Location: 5F 3-South Packaging
| Process | Lab | Tool | Process Category | Subcategory | Description | |
|---|---|---|---|---|---|---|
| EML | hotpress | Photo | Bond | Pressing for thermoplastic films | ||
| EML | plasmatherm | Deposition, Etch | PECVD, RIE | Plasma Etch and Deposition | ||
| TRL | 2Dtransfer-platingHood | Wet | Acids | Electroplating wet bench and fume hood | ||
| ICL | diesaw | Packaging | Physical | Wafer dicing saw | ||
| ICL | diesaw-3240 | Packaging | Physical | Wafer dicing saw | ||
| ICL | GnP | Wet | Other | Chemical Mechanical Polishing to planarize surfaces | ||
| ICL | goldwire | Packaging | Physical | Gold ball bonder for device packaging |