Tools that have a load-lock, where the user is not required to place the sample directly into the process chamber
Process | Lab | Tool | Process Category | Subcategory | Description
| Color Code
|
---|
+ | EBL |
Elionix
| Photo | Expose
| Electron beam lithography system
| Red &Green
|
+ | EML |
plasmatherm
| Deposition, Etch | PECVD, RIE
| Plasma Etch and Deposition
| EML
|
+ | EML |
SputtererAJA
| Deposition | Sputter
| Sputter deposition tool
| EML
|
+ | ICL |
ALD-Oxford
| Deposition | CVD, PECVD
| Atomic Layer Deposition
| Green
|
+ | ICL |
AME5000
| Etch | RIE
| RIE etcher for frontend silicon processes
| Green
|
+ | ICL |
pTrack
| Photo | Coat
| Automated coater and developer track
| Green
|
+ | ICL |
concept1
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, and TEOS
| Green
|
+ | ICL |
DCVD
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, and a-Si
| Green
|
+ | ICL |
endura
| Deposition | Sputter
| Metal sputter deposition
| Green
|
+ | ICL |
epi-Centura
| Deposition | CVD
| Not open to public
| Green
|
+ | ICL |
i-stepper
| Photo | Expose
| i-line stepper
| Red &Green
|
+ | ICL |
LAM490B
| Etch | RIE
| Chlorine based plasma etching of silicon
| Green
|
+ | ICL |
LAM590-ICL
| Etch | RIE
| Fluorine based plasma etching of silicon oxide and nitrides
| Green
|
+ | ICL |
Oxford-100_PECVD
| Deposition, Etch | PECVD
| Dual chamber PECVD and plasma etch tool
| Red
|
+ | ICL |
Oxford-100_Etch
| Deposition, Etch | RIE
| Dual chamber PECVD and plasma etch tool
| Red
|
+ | ICL |
rainbow
| Etch | RIE
| Chlorine based plasma etcher for metals
| Green
|
+ | ICL |
RTA2
| Diffusion | Bake
| Rapid Thermal Annealing
| Green
|
+ | ICL |
RTA-pieces
| Diffusion | Bake
| Rapid Thermal Annealing
| Red
|
+ | ICL |
RTP
| Diffusion | Bake
| Rapid Thermal Annealing
| Green
|
+ | ICL |
RTP-Si
| Diffusion | Bake
| Rapid Thermal Annealing
| Green
|
+ | TRL |
AJA-TRL
| Deposition | Sputter
| Sputter deposition tool
| Red
|
+ | TRL |
eBeamFP
| Deposition | Evaporate
| Fast pumping metal evaporator
| Red
|
+ | TRL |
LAM590-TRL
| Etch | RIE
| Fluorine based plasma etching of oxide and nitrides
| Red
|
+ | TRL |
plasmaquest
| Etch | RIE
| Fluorine and Chlorine general purpose plasma deposition and etch tool
| Red
|
+ | TRL |
SAMCO
| Etch | RIE
| Chlorine based plasma etcher for III-V materials
| Red
|
+ | TRL |
sts1
| Etch | DRIE
| Deep reactive ion etcher for silicon
| Red
|
+ | TRL |
sts2
| Etch | DRIE
| Deep reactive ion etcher for silicon
| Green
|
+ | TRL |
sts-CVD
| Deposition | PECVD
| PECVD deposition of oxides, nitrides, a-Si, SiC, and P-doped a-Si
| Red
|
+ | TRL |
sts-Pegasus
| Etch | DRIE
| Deep reactive ion etcher for silicon
| Red
|