Ryan O'Keefe
Technican C
39-312 - (617)253-0502 - rmokeefe@mtl.mit.edu

---

Process	Lab	Tool	Process Category	Subcategory	Description	Color Code
+	ICL	diesaw-3240	Packaging	Physical	Wafer dicing saw	Red
+	ICL	GnP	Wet	Other	Chemical Mechanical Polishing to planarize surfaces	Red &Green
+	LEAP	DieBonder	Packaging	Physical	Automated pick and place	Red
+	LEAP	PlasmaCleaner	Packaging	Clean	Plasma parts cleaning	Red
+	LEAP	ReflowOven	Packaging	Bake	Reflow oven	Red
+	LEAP	QuickVisionMicroscope	Packaging	Physical	Automated imaging microscope	Red