Machines by Specialist: Robert Bicchieri
Robert Bicchieri
Research Specialist, Vacuum Etching
39-215 - (617)253-6418 - bic@mtl.mit.edu
Process | Lab | Tool | Process Category | Subcategory | Description | |
---|---|---|---|---|---|---|
ICL | LAM490B | Etch | RIE | Chlorine based plasma etching of silicon | ||
ICL | LAM590-ICL | Etch | RIE | Fluorine based plasma etching of silicon oxide and nitrides | ||
ICL | Oxford-100_PECVD | Deposition, Etch | PECVD | Dual chamber PECVD and plasma etch tool | ||
ICL | Oxford-100_Etch | Deposition, Etch | RIE | Dual chamber PECVD and plasma etch tool | ||
ICL | VTR | Diffusion | CVD | Low stress silicon nitride deposition | ||
TRL | CCNT | Deposition | PECVD | Carbon nanotube growth | ||
TRL | LAM590-TRL | Etch | RIE | Fluorine based plasma etching of oxide and nitrides | ||
TRL | plasmaquest | Etch | RIE | Fluorine and Chlorine general purpose plasma deposition and etch tool | ||
TRL | XeF2 | Etch | RIE | XeF2 isotropic etching of silicon |