Machines by Specialist: Robert Bicchieri

Robert Bicchieri
Research Specialist, Vacuum Etching
39-215 - (617)253-6418 - bic@mtl.mit.edu
| Process | Lab | Tool | Process Category | Subcategory | Description | |
|---|---|---|---|---|---|---|
| ICL | LAM490B | Etch | RIE | Chlorine based plasma etching of silicon | ||
| ICL | LAM590-ICL | Etch | RIE | Fluorine based plasma etching of silicon oxide and nitrides | ||
| ICL | Oxford-100_PECVD | Deposition, Etch | PECVD | Dual chamber PECVD and plasma etch tool | ||
| ICL | Oxford-100_Etch | Deposition, Etch | RIE | Dual chamber PECVD and plasma etch tool | ||
| ICL | VTR | Diffusion | CVD | Low stress silicon nitride deposition | ||
| TRL | CCNT | Deposition | PECVD | Carbon nanotube growth | ||
| TRL | LAM590-TRL | Etch | RIE | Fluorine based plasma etching of oxide and nitrides | ||
| TRL | plasmaquest | Etch | RIE | Fluorine and Chlorine general purpose plasma deposition and etch tool | ||
| TRL | XeF2 | Etch | RIE | XeF2 isotropic etching of silicon |