Etching is primarily anisotropic (direction specific etch rates)

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Process	Lab	Tool	Process Category	Subcategory	Description	Color Code
+	ICL	AME5000	Etch	RIE	RIE etcher for frontend silicon processes	Green
+	ICL	GnP	Wet	Other	Chemical Mechanical Polishing to planarize surfaces	Red &Green
+	ICL	LAM490B	Etch	RIE	Chlorine based plasma etching of silicon	Green
+	ICL	LAM590-ICL	Etch	RIE	Fluorine based plasma etching of silicon oxide and nitrides	Green
+	ICL	Oxford-100_PECVD	Deposition, Etch	PECVD	Dual chamber PECVD and plasma etch tool	Red
+	ICL	Oxford-100_Etch	Deposition, Etch	RIE	Dual chamber PECVD and plasma etch tool	Red
+	ICL	rainbow	Etch	RIE	Chlorine based plasma etcher for metals	Green
+	ICL	TMAH-KOHhood	Wet	Acids	Silicon bulk wet etching	Red &Green
+	TRL	LAM590-TRL	Etch	RIE	Fluorine based plasma etching of oxide and nitrides	Red
+	TRL	plasmaquest	Etch	RIE	Fluorine and Chlorine general purpose plasma deposition and etch tool	Red
+	TRL	SAMCO	Etch	RIE	Chlorine based plasma etcher for III-V materials	Red
+	TRL	sts1	Etch	DRIE	Deep reactive ion etcher for silicon	Red
+	TRL	sts2	Etch	DRIE	Deep reactive ion etcher for silicon	Green
+	TRL	sts-Pegasus	Etch	DRIE	Deep reactive ion etcher for silicon	Red