Machines by Specialist: Dennis Ward
Dennis Ward
Research Specialist
39-561 - (617)452-4905 - ward@mtl.mit.edu
Process | Lab | Tool | Process Category | Subcategory | Description | |
---|---|---|---|---|---|---|
TRL | Balzer-Elionix | Deposition | Sputter | SEM or EBL sample preparation | ||
TRL | develop-Brewer | Photo | Coat | Resist develop and postbake | ||
TRL | EV501 | Photo | Bond | Bonder system to apply heat, vacuum and pressure | ||
TRL | EV620 | Photo | Bond | Aligner for bonding | ||
TRL | FLX | Metrology | Profile | Thin film stress measurement | ||
TRL | Heidelberg | Photo | Expose | Laser direct-write exposure for wafers and masks | ||
TRL | MLA-150 | Photo | Expose | Direct-write lithography for wafers and larger pieces | ||
TRL | parylene | Deposition | CVD | Parylene depopsition | ||
TRL | PMMAspinner | Photo | Coat | Manual coater for PMMA and other photoresists | ||
TRL | PZTcoater | Deposition | Spin-Coat | Coater to apply PZT films | ||
TRL | PZTfurnace | Deposition | Bake | Bake oven for PZT coated wafers | ||
TRL | Resonetics | Photo | Expose | Laser ablation system | ||
TRL | SU8oven | Photo | Bake | Oven to dry foil from SU8 coater | ||
TRL | SU8spinner | Photo | Coat | Manual spin-coater for SU8 resists | ||
TRL | TBM-8 | Photo | Bond | Front-to-back alignement measurement |