Machines by General Keyword: requires flat
| Process | Lab | Tool | Process Category | Subcategory | Description | |
|---|---|---|---|---|---|---|
| ICL | DCVD | Deposition | PECVD | PECVD deposition of oxides, nitrides, and a-Si | ||
| ICL | endura | Deposition | Sputter | Metal sputter deposition | ||
| ICL | epi-Centura | Deposition | CVD | Not open to public | ||
| ICL | i-stepper | Photo | Expose | i-line stepper | ||
| ICL | rainbow | Etch | RIE | Chlorine based plasma etcher for metals | ||
| ICL | RTP | Diffusion | Bake | Rapid Thermal Annealing | ||
| ICL | RTP-Si | Diffusion | Bake | Rapid Thermal Annealing | ||
| ICL | UV1280 | Metrology | Thickness | Thin film characterization | ||
| TRL | FLX | Metrology | Profile | Thin film stress measurement | ||
| TRL | sts-Pegasus | Etch | DRIE | Deep reactive ion etcher for silicon |