Machines by General Keyword: requires flat
Process | Lab | Tool | Process Category | Subcategory | Description | |
---|---|---|---|---|---|---|
ICL | DCVD | Deposition | PECVD | PECVD deposition of oxides, nitrides, and a-Si | ||
ICL | endura | Deposition | Sputter | Metal sputter deposition | ||
ICL | epi-Centura | Deposition | CVD | Not open to public | ||
ICL | i-stepper | Photo | Expose | i-line stepper | ||
ICL | rainbow | Etch | RIE | Chlorine based plasma etcher for metals | ||
ICL | RTP | Diffusion | Bake | Rapid Thermal Annealing | ||
ICL | RTP-Si | Diffusion | Bake | Rapid Thermal Annealing | ||
ICL | UV1280 | Metrology | Thickness | Thin film characterization | ||
TRL | FLX | Metrology | Profile | Thin film stress measurement | ||
TRL | sts-Pegasus | Etch | DRIE | Deep reactive ion etcher for silicon |