Machines by Specialist: David Terry

David Terry
Project Technician
39-312 - (617)253-6291 - dterry@mtl.mit.edu
| Process | Lab | Tool | Process Category | Subcategory | Description | |
|---|---|---|---|---|---|---|
| TRL | acid-hood | Wet | Acids | Acid processing station | ||
| TRL | asherMatrix-TRL | Photo | Clean | Single wafer oxygen plasma for photoresist removal | ||
| TRL | asher-TRL | Photo | Clean | Barrel asher for resist removal | ||
| TRL | coater | Photo | Coat | Manual spin-coater for photoresists | ||
| TRL | dektak-XT | Metrology | Profile | Stylus Profilerometer | ||
| TRL | eBeamAu | Deposition | Evaporate | Metal evaporator | ||
| TRL | ellipsometer-TRL | Metrology | Thickness | Thin film thickness measurement | ||
| TRL | EV1 | Photo | Expose | Contact mask aligner | ||
| TRL | EV-LC | Photo | Expose | Contact mask aligner | ||
| TRL | Greenflo | Wet | Acids | Acid processing station | ||
| TRL | HMDS-TRL | Photo | Bake | HMDS oven | ||
| TRL | hotplate1 | Photo | Bake | Hotplate for lithography | ||
| TRL | hotplate2 | Photo | Bake | Hotplate for lithography | ||
| TRL | hotplate300 | Photo | Bake | Hotplate for lithography | ||
| TRL | MA-6 | Photo | Expose | Contact mask aligner | ||
| TRL | nanospec | Metrology | Thickness | Thin film thickness measurement | ||
| TRL | OAI-Flood | Photo | Expose | Flood exposure for image reversal resists | ||
| TRL | photo-wet-Au | Wet | Solvents | Solvent fume hood with sonicator | ||
| TRL | photo-wet-l | Wet | Solvents | Wetbench for photoresist development | ||
| TRL | photo-wet-r | Wet | Solvents | Wetbench for photoresist development | ||
| TRL | postbake | Photo | Bake | Bake oven 120C | ||
| TRL | prebakeovn | Photo | Bake | Bake oven 90C | ||
| TRL | SolventHood-TRL | Wet | Solvents | Solvent fume hood | ||
| TRL | UVozone-Au | Etch | Clean | Cleans residual organics | ||
| TRL | varTemp | Photo | Bake | Bake oven for variable temperature |